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FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board

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Good quality Multilayer PCB
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  • High Precision FR4 PCB suppliers


High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.



(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.




Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?





FR4 PCB Sample Introduction

FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board

China FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board Supplier
FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board Supplier FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board Supplier FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board Supplier

Large Image :  FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCET

Payment & Shipping Terms:

Minimum Order Quantity: 1pc
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 PCB Layer: 1-28layers
Min. Hole Size: 6mil Board Size: Min 6 X 6mm | Max 457 X 610m
Surface Finishing: ENIG, Immersion Silver, Etc. Copper Thickness: 0.5oz - 2.0oz
Assembly Option: Yes Electronics Source: Yes


Layer of number 4 Surface finish ENIG
Base material FR4 Cu THK 1OZ
Board THK 0.8mm Origin Shenzhen
Board size 12*6cm Solder mask Green


What is FR-4 PCB material?
We’ve all heard the abbreviation FR4 being thrown about at some point when shopping for a PCB fab house, but what does it actually mean? And what implications does it have when choosing a PCB material? This post will help clear the fog and introduce some popular materials available for rigid PCBs.


Most likely, you will have seen FR4 as the standard option for small batch or prototype PCBs like in Seeed Fusion. FR-4 is the code name of a flame-resistant material grade, which means that the resin material must be able to self-extinguish after burning. It is not a material name, but a material grade. It has many sub gradings and types such as TG130, High TG, FR4-Rogers.


FR4 PCB 94V0 Board Assembly 4L Hot Air Levelling 2.0mm Thick Printed Circuit Board


We can offer production with high quality and competitive:

Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L_20L, HDI 20-28 , HDI
Material FR4
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , Rogers3003+FR4
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink
1-2L Lead-time 3-7 days 1-2 days
4- 8L Lead-time 7-10 days 2-7 days
10-18L Lead-time 10-15 days 4-9 days
20-28L Lead-time 15-20 days
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>


In a typical PCB, the core provides the rigidity and the foundation on which the PCB traces can be ‘printed’ onto. In addition, the FR4 core and laminates form the electrical isolation separating copper layers.


For double layer boards, an FR4 core separates the top and bottom copper layers whereas, for multilayer PCBs, additional layers of FR4 prepreg are sandwiched between the inner core and the outer copper layers. The desired final thickness of the PCB can be controlled by mixing different laminate thicknesses. This arrangement is referred to as the stack-up.


For example, a typical 4 layer board of 1.6 mm thickness may have a core of thickness of 1.2 mm. Two sheets of 0.12 mm prepreg topped with copper, solder mask and silkscreen roughly make up 1.6 mm. To build a 1.2 mm board, the core can be replaced with a 0.8 mm thick core.


The name FR4 comes from the NEMU grading system where the ‘FR’ stands for ‘fire retardant’, compliant with the UL94V-0 standard. You may have noticed that on the Seeed Fusion order page the FR4 option is followed by TG130. The TG refers to the transition glass temperature – the temperature at which the glass-reinforced material will start to deform and soften. For Fusion’s standard boards this value is 130°C, which is more than enough for most applications. Special High TG materials can withstand temperatures of 170 – 180°C and can be ordered online using the Advanced PCB service.


Most FR4 laminates owe their flame resistance to its bromine content, a non-reactive halogen commonly used in industries for its flame retarding properties. This gives FR4 materials obvious advantages as a stock PCB material in terms of fire safety while in the field. It is also a little reassuring if your soldering skills are not up to standard.


However, bromine is a halogen which are highly toxic chemicals that are released in the environment when the material is incinerated. Even small amounts are sufficient to cause serious harm to humans or even death. To reduce the use of such hazardous substances in our everyday products, halogen-free FR4 laminates are readily available.


Other similar grades used for PCBs include FR2, which is a type of fire retarding fiberglass resin bonded paper and G10 which is not flame resistant at all. FR2 is cheaper and so has its uses in mass production of low-end electrical equipment. G10, a predecessor to FR4, has all but been taken over by the safer FR4 standard. Its only use in PCBs now is in designs that desire this flammable property.


There are also specialized FR4 laminates designed for high-speed applications, like Rogers and Taconic materials. These materials have stable dielectric constants (Dk) and low dielectric loss tangents (Df) that are essential for good signal integrity at high frequencies. Production of these laminates is difficult, however, so they constitute a significant portion of the total cost of the boards.





FR5 (High Tg FR4)



Glass Transition Temperature -Tg (°C)


150 - 210


> 250

Dielectric Constant -dk

4.2 - 4.8

4.5 - 5.4

2.5 - 2.8


Lengthwise Bending Strength (N/mm)





Crosswise Bending Strength (N/mm)





Copper Adhesiveness(N/mm)


> 1.4

> 1.4



Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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