Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section
2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.
Payment & Shipping Terms:
|Color:||Blue||Material:||FR4 +Rogers Material|
|Copper Thinknes:||1 Oz||Min Line Width:||4 Mil|
|Min Line Space:||4mil||Surface Finish:||Immersion Tin|
multi layered pcb,
multilayer pcb fabrication
Fr4 Mixed Rogers Material Multilayer PCB High Frequency PCB With UL Lead free Hasl
Quick Detail :
|Surface Finish||Immersion Tin
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
1. Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
|Layer||1 to 28 layers|
|Material type||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|Board thickness||0.21mm to 7.0mm|
|Copper thickness||0.5 OZ to 7.0 OZ|
|Copper thickness in hole||>25.0 um (>1mil)|
|Max. Board Size: 23 × 25 (580mm×900mm)|
|Min. Drilled Hole Size: 3mil (0.075mm)|
|Min. Line Width: 3mil (0.075mm)|
|Min. Line Spacing: 3mil (0.075mm)|
|HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|Shape tolerance: ±0.13|
|Hole tolerance: PTH: ±0.076 NPTH: ±0.05|
|Certificate||UL, ISO 9001, ISO 14001|
|Special requirements||Buried and blind vias+controlled impedance +BGA|
|Profiling||Punching, Routing, V-CUT, Beveling|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
• High Decomposition Temperature (Td) (> 325º C)
• Low Coefficient of Thermal Expansion (CTE) ((3.0%-3.8%)
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 4)
• Compatible with standard and lead-free assembly.
• Laminate thickness available from 0.005” to 0.125”
• Pre-preg thicknesses available (approximate after lamination):
(1080 glass style) 0.0022”
(2116 glass style) 0.0042”
(7628 glass style) 0.0075”
Production Description :
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.