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Introduction:
High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
Material:
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
FAQ:
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
A:YES
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | PCB Layer: | 1-28layers |
|---|---|---|---|
| Min. Hole Size: | 6mil | Board Size: | Min 6 X 6mm | Max 457 X 610m |
| Surface Finishing: | ENIG, Immersion Silver, Etc. | Copper Thickness: | 0.5oz - 2.0oz |
| Assembly Option: | Yes | Electronics Source: | Yes |
Specification:
| Layer of number | 4 | Surface finish | ENIG |
| Base material | FR4 | Cu THK | 1OZ |
| Board THK | 0.8mm | Origin | Shenzhen |
| Board size | 12*6cm | Solder mask | Green |
FR4 is a good general purpose material as its parameters are mostly comparable to the other alternatives. It excels in structural integrity with a 2.0 N/mm copper adhesiveness and matches the alternatives in bending strength. However, compared to the alternatives, FR4 has a low Tg. This means that the material may be subject to deformation or breakdown when exposed to excessive temperatures, especially over time.
FR4 is rightly the most used material in PCB construction. Boards made from FR4 are strong, water resistant, and provide good insulation between copper layers that minimizes interference and supports good signal integrity.
At Xinchenger, the industry leader in fast, high-quality PCB prototype and low-volume manufacturing, we are capable to meet your board material needs for any case. Welcome to contact us for any questions or any RFQs.
We can offer production with high quality and competitive:
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L_20L, HDI | 20-28 , HDI |
| Material | FR4 | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Ro4350 , Rogers3003+FR4 | ||
| Maximum Size | 610mm X 1200mm | 1200 - 2000MM |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink | ||
| 1-2L Lead-time | 3-7 days | 1-2 days |
| 4- 8L Lead-time | 7-10 days | 2-7 days |
| 10-18L Lead-time | 10-15 days | 4-9 days |
| 20-28L Lead-time | 15-20 days | |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
FR4 Thickness Design Considerations
If you start your design process by choosing the correct PCB thickness, you will avoid problems that might require a redesign later. There are a number of factors that are influenced by the PCB thickness. Before you start designing your board, think about the following design issues:
Form factor and flexibility: Does your PCB have a strict form factor requirement? Thinner boards tend to be used in smaller devices and can flex more than a thicker board. A more flexible board may be unusable with a pick & place machine. Electrical connections in flexible boards can also break unless they have some mechanical support.
Components and connections: Will the device have any components that require the Printed Circuit Board to have a specific PCB thickness? Components like USB edge connectors and some through-hole components require the PCB be the correct PCB thickness. BGA connectors are another example of components that generally require more copper thickness.
Thermal and Reliability Considerations
All materials expand at higher temperatures, and the thermal expansion coefficient must be taken into consideration when choosing the PCB thickness. The thermal expansion coefficient of FR4 changes drastically above the material’s glass transition temperature (140 °C). The board can become electrically and mechanically unstable when the board operates above the glass transition temperature.
The reliability of the trace materials, laminate materials, and solder joints on a PCB board laminate are determined by the resistance to thermal cycling. When the thermal expansion coefficients of the different materials are mismatched, fatigue occurs after repeated thermal cycling. Copper plating in vias and solder balls are especially vulnerable to damage under thermal cycling.
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Feature |
Capability |
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Quality Grade |
Standard IPC 2 |
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Number of Layers |
1 – 32layers |
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Shortest Build Time |
0.5days |
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Material |
FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
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Board Size |
Min 6*6mm | Max 600*700mm |
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Board size tolerance |
±0.1mm |
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Board Thickness |
0.4mm – 3.2mm |
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Board Thickness Tolerance |
±0.1mm – ±10% |
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Copper Weight |
0.5oz – 6.0oz |
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Inner Layer Copper Weight |
0.5oz – 2.0oz |
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Copper Thickness Tolerance |
+0μm +20μm |
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Min Tracing/Spacing |
3mil/3mil |
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Solder Mask Color |
Green, White, Blue, Black, Red, Yellow |
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Silkscreen Color |
White, Blue, Black, Red, Yellow |
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Surface Finish |
HASL – Hot Air Solder Leveling Lead Free HASL – RoHS |
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Min Annular Ring |
3mil |
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Min Drilling Hole Diameter |
Standard 8mil, Advanced 6mil, Laser drill 4mil |
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Min Width of Cutout (NPTH) |
0.8mm |
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NPTH Hole Size Tolerance |
±.002″ (±0.05mm) |
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Min Width of Slot Hole (PTH) |
0.6mm |
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PTH Hole Size Tolerance |
±.003″ (±0.08mm) – ±.006″ (±0.15mm) |
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Surface/Hole Plating Thickness |
20μm – 30μm |
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SM Tolerance (LPI) |
.003″ (0.075mm) |
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Aspect Ratio |
1.10 (hole size: board thickness) |
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Test |
AOI, 10V – 250V flying probe or testing fixture |
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Impedance tolerance |
±5% – ±10% |
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SMD Pitch |
0.2mm(8mil) |
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BGA Pitch |
0.2mm(8mil) |
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Chamfer of Gold Fingers |
20, 30, 45, 60 |
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Other Techniques |
Gold fingers,Blind and Buried holes,Peelable solder mask |
