Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

China Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control Supplier

Large Image :  Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008
Model Number: XCER

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Base Material: KB Fr4 Name: FR4 High Speed Pcb
Board Thickness: 20mil Copper THK: 1OZ
Board Size: 6*3cm Surface Finish: Immersion Gold
High Light:

pcb manufacturing process

,

fr4 circuit board

Fr4 High Speed Multilayer HDI PCB Board Fabrication With Impedance Control
 
 
Specification
 

PCB Type:

FR4 PCB

Layer :

4 layer

Min .Line Width/Space:

8milmil/8mil

Min. Via Diameter:

0.3mm

Finish Thickness:

20mil

Surface Finish:

ENIG

Size:

3*6MM

Material:

KB FR4

Color:

green

Application:

aviation

 
 
 
High frequency PCB Introduce:
 
 

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254    0.508  0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

 
 
Parameter
 

Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 
 
Description:
 
FR4 Multi-Layer PCB refer to printed circuit board has more than two copper layers, such as 4L, 6L, 8L, 10L, 12L, etc. As technology improving, people can put more and more copper layers on the same board. Currently, we can produce 20L-32L FR4 PCB.
By this structure, engineer can put trace on different layers for different purpose, such as layers for power, for signal transfering, for EMI shielding, for components assembly, and so on. In order to avoid too many layers, Buried Via or Blind via will be designed in multi-layer PCB. For board more than 8 layers, high Tg FR4 material will be popular than normal Tg FR4.
More layers it is, more complex & difficult the manufacturing will be, and more expensive the cost will be. The lead time of multi-layer PCB is different from normal one, please contact us for accurate leading time.
 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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