Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

China Fr4 High Frequency PCB Circuit Green For Wireless Communication Field Supplier
Fr4 High Frequency PCB Circuit Green For Wireless Communication Field Supplier Fr4 High Frequency PCB Circuit Green For Wireless Communication Field Supplier

Large Image :  Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,FCC,Rohs,ISO9001,SGS,UL
Model Number: XCEF

Payment & Shipping Terms:

Minimum Order Quantity: 1PCS
Price: USD 1-500
Packaging Details: inner vacuum package, outer carton box
Payment Terms: Western Union, L/C, T/T
Supply Ability: 10000000pcs / per month
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Detailed Product Description
Color: Green Layer: 2
Board Size: 6*5cm Board THK: 1.2mm
Cu THK: 35UM Panel Size: 3*2
High Light:

pcb manufacturing process

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Custom Printed Circuit Board

Fr4 High Frequency PCB Circuit Green For Wireless Communication Field​

 

 

Features:

>Glass-reinforced hydrocarbon and ceramic dielectric

>Excellent high frequency performance due to low dielectric tolerance and loss

>Stable electrical properties versus frequency

>Low Z-axis expansion and excellent dimensional stability

 

Specification:

 

Base Material: Fr4 high frequency 
Layer:2
Thickness: 1.2MM
Copper weight:1OZ
Surface finish: Immersion gold

 

Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.

 

 

Applications:

High frequency high frequency wireless communication

High speed computer

Satellite signal transmission equipment

Microstrip and cellular base station

Antennas and power amplifiers

LNA/LNB

 

 

Parameter:

 

Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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