HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.
HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
Payment & Shipping Terms:
|Material:||Single Sided Pcb||Brand:||XCE|
|Name:||One Layer Pcb Boards||Line Width:||10mil|
|Line Space:||10 Mil||Application:||Electronics Boards|
single sided pcb board,
pcb circuit board
Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB
high-end service quality
professional pcb&pcba fabriaction
|Finish Copper Thinckness||35μm/35μm|
|Board Thinckness Tolerance||±10%|
|Warp & Wist||0.70%|
|Testing||100% Electric Test, IPC Class II.|
1 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format
FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.
Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate.
Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.
Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.
Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.
|Raw Material||FR-4 (Tg 130 available)|
|Layer Count||Single Sided|
|Surface Finish||ENIG(Electroless Nickel Immersion Gold)|
|Min. Trace Width/Spacing||0.075/0.075mm|
|Min. Hole Size||0.25mm|
|Hole Wall Copper Thickness||≥20μm|
|Packaging||Inner: Vacuum-packed in soft plastic bales|
Outer: Cardboard Cartons with double straps
|Advantage||Competitive Price,Fast Delivery,OEM&ODM,Free Samples,|
|XCE PCB technical specification|
|Annual stock meterial||Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free|
|Min board thickness||2 layer 0.2mm|
|4 layer 0.4mm|
|6 layer 0.6mm|
|8 layer 0.8mm|
|10 layer 1.0mm|
|Max panel size||508*610mm|
|Board thickness tolerance||T≥0.8mm±8%,T＜0.8mm±5%|
|Wall hole copper thickness||＞0.025mm(1mil)|
|Min line width||4mil/4mil(0.1/0.1mm)|
|Min bonding pad space||0.1mm(4mil)|
|PTH aperture tolerance||±0.075mm(3mil)|
|NPTH aperture tolerance||±0.05mm(2mil)|
|Hole site deviation||±0.05mm(2mil)|
|Min buried blind via||0.2mm(8mil)|
|Outer cooper thickness||1oz-5oz|
|Inner cooper thickness||1/2 oz-4oz|
|SMT min green oil width||0.08mm|
|Min green oil open window||0.05mm|
|Insulation layer thickness||0.075mm-5mm|
|Special technology||Inpedance,blind buried via,thick gold,aluminumPCB|
|Surface finish||HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating|