Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB

China Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB Supplier

Large Image :  Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: FR4 single sided pcb

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Single Sided Pcb Brand: XCE
Origin: China Copper THK: 1OZ
Name: One Layer Pcb Boards Line Width: 10mil
Line Space: 10 Mil Application: Electronics Boards
High Light:

single sided pcb board

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pcb circuit board

Epoxy Glass Fibre FR4 custom - made pcb Single Sided Copper Clad Prototype PCB
 
 
 
Specification:
factory direct
quality assurance
one-stop service
high-end service quality
professional pcb&pcba fabriaction
 
Quick detail:

  
LayerSingle Layer
MaterialFR4
Board Thinckness1.2MM
Size12*9CM
Solder MaskGreen
SilkscreenWhite
Finish Copper Thinckness35μm/35μm
Surface FinishHASL
Board Thinckness Tolerance±10%
Impedance Control±10%
Warp & Wist0.70%
Testing100% Electric Test, IPC Class II.

 
 
Specification:
1 Layer Black Soldermask Immersion Gold High TG PCB Board In Panel Format
FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.
 
Defined impedance 4 layer black soldermask immersion gold board is: a good laminated structure will be able to play on the printed circuit board characteristic impedance control, the traces can be formed easily controlled and predictable transmission line structure is called impedance plate.
 
Current common characteristic impedance is divided into: single-ended (line) impedance differential (fixed) impedance coplanar impedance.
Single-ended (wire) Impedance: English single ended impedance, refers to a single signal line measured impedance.
Difference (Fixed) Impedance: English differential impedance, differential drive means to the test in two monospaced equally spaced transmission line impedance.

Products Details

Raw MaterialFR-4 (Tg 130 available)
Layer CountSingle Sided
Board Thickness1.2mm
Copper Thickness1.0oz
Surface FinishENIG(Electroless Nickel Immersion Gold)
Solder MaskGreen
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement300×400mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,

 

XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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