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Introduction:
Aluminum PCB/Metal Core PCB/MCPCB
Among all Metal core PCBs(MCPCBs,known for their ability to provide effective thermal dissipation for electronic products), Aluminum PCBs is the most common type-the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.Aluminum PCBs printed by us are widely used for LED lighting, power equipment and automotive systems.
We can produce 1Layer, 2Layer ,4 Layer and 6l ayer Aluminum PCB.Multilayer aluminum PCB is mainly used by high power industria products,Like outdoor Led screen .
Aluminum Core materials:
Peeling strength (n/mm):1.8
Insulation resistance (ω):>1*10 g
Breakdown voltage (vdc):>2 k
Soakable soldering (°C/m):280°C/260°C,1 min,no bubble&delamination
Thermal conductivity (ω/m-k):>0.8
Thermal resistance (°C/ω):< 1.2
Combustibility:fv-o
Dielectric constant (1mhz):4
Dielectric loss angle (tangent):0.03
Product Details:
Payment & Shipping Terms:
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| Board Size: | 6*6cm | Board THK: | 0.8mm |
|---|---|---|---|
| Cu THK: | 2OZ | Material: | FR4 |
| Application: | Consumer Electronics | Layer: | 2 |
| High Light: | pcb maker,printed circuit board manufacturing |
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Electronics 2OZ Copper High TG PCB Prototype FR4 Double Layer PCB
Application:
Automobile
Backplanes
Servers and Networking
Telecommunications
Data Storage
Heavy Copper Application
Specification:
| Base Material: FR4 |
| Layer:2 |
| Thickness: 0.6MM |
| Copper weight:2OZ |
| Surface finish: HASL Lead free |
Key Features
Advanced High Tg Resin Technology
Industrial standard material with high Tg (175℃ by DSC) multifunctional epoxy resin and excellent thermal reliability.
Lead-Free Assembly Compatible
RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃.
Friendly Processing and CAF Resistance
Friendly PCB process like high Tg FR4. Users can short the learning curve when using this material.
CAF Resistance
Low thermal expansion coefficient (CTE) helps to excellent thermal reliability and CAF resistance providing long-term reliability for industrial boards and automobile application.
Available in Variety of Constructions
Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil.
Parameter:
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
