Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

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PCB Assembly

  • High Precision PCB Assembly suppliers

Introduction:
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement.

 

 

PCB Prototype Engineering services :
DFM, DFT, DOE
Develop control plans
Value add engineering services

PCB Prototype Assembly services:
NPI
SMT: Surface mount assembly, single & double-sided
Plated through-hole,Selective soldering
– Mixed technologies: SMT, through-hole, electro-mechanical assembly

PCB Assembly Sample Introduction

Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided

China Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided Supplier
Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided Supplier Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided Supplier

Large Image :  Electronic FR4 PCBA / PCB Board Assembly Service 2 Layer Single Sided or Double-sided

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEA

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 2
Color: Green Min Line Space: 10mil
Min Line Width: 10mil Copper Thickness: 1OZ
Size: 5*4cm Board THK: 1.0MM
Panel: 4*5 Surface Finish: HASL
Model: XCEA Brand: XCE
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pcb board assembly

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PCBA service

High Quality Electronics Products PCB / PCBA Assembly Service 

 

 

 

NO

         Item

       Craft Capacity

1              

Layer                                                 

1-30 Layers                                                                               

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing);  Flying Probe Testing 

18

Other test

ImpedanceTesting,Resistance Testing, Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)

 

 

Product type:

 

Single-sided, double-sided and multilayer printed circuit boards (PCB), flexible (soft) of circuit boards, blind buried plate.
Max size: single-sided, double-sided: 1000mm * 600mm MLB: 600mm * 600mm
Highest Number of floors: 20 floors
Processing board thickness: 0.4mm -4.0mm rigid plate flexible plate 0.025mm --- 0.15mm
Copper foil substrate thickness: rigid plate 18μ (1 / 2OZ), 35μ (1OZ), 70μ (2OZ) flexible board 0.009MM 0.018mm 0.035mm 0.070mm 0.010mm
Common substrates: FR-4, CEM-3, CEM-1, 94HB, 94VO, poly vinyl chloride, polyester, polyimide ammonium.

 


Process Capability:


(1) Drilling: Minimum aperture 0.15MM
(2) metal hole: Minimum aperture 0.15mm, thickness / aperture ratio of 4: 1
(3) wire width: Minimum width: gold plate 0.075mm, 0.10mm tin plate
(4) lead spacing: Minimum spacing: gold plate 0.075mm, 0.10mm tin plate
(5) gold plate: Ni layer thickness:> or = 2.5μ gold layer thickness: 0.05-0.1μm or according to customer requirements
(6) HASL: tin layer thickness:> or = 2.5-5μ
(7) paneling: Wire-to-edge minimum distance: 0.15mm hole to edge minimum distance: 0.2mm Minimum Shape tolerance: ± 0.12mm
(8) outlet chamfer: angle: 30 degrees, 45 degrees, 60 degrees Depth: 1 -3mm
(9) V cut: angle: 30 degrees, 35 degrees, 45 degrees Depth: 2/3 thickness minimum size: 80mm * 80mm
(10) off test:
Resistance to soldering heat: 85 --- 105 ℃ / 280 ℃ --- 360 ℃
Flexible sheet resistance flexing resistance / chemical resistance: full compliance with international standards

 

 

Inspection:

 

1. The main inspection hole metallization quality status, should ensure that the hole was no extra burr, black holes, holes and so on;
2. Check the substrate surface dirt and other unwanted objects;
3. Check the board number, drawing number, process documentation and process description;
4. clarify racking parts, racking requirements and can withstand the plating tank plating area;
5. plating area, the process parameters to be clear, to ensure the stability and viability of the electroplating process parameters;
6. conductive parts cleaning and preparation, the solution was presented first energization process active;
7. finds bath composition is checked, plate surface area status; such as the use of spherical anode bar installed, you must also check the consumption;
8. Check the voltage solid case and the contact area, the current fluctuation range.

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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