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Introduction:
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement.
PCB Prototype Engineering services :
DFM, DFT, DOE
Develop control plans
Value add engineering services
PCB Prototype Assembly services:
NPI
SMT: Surface mount assembly, single & double-sided
Plated through-hole,Selective soldering
– Mixed technologies: SMT, through-hole, electro-mechanical assembly
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 2 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 5mil |
| Min Line Width: | 5mil | Copper Thickness: | 1OZ |
| Board Size: | 120*75mm | Panel: | 1 |
| Surface: | HASL-LF | ||
| High Light: | PCBA service,pcb board assembly |
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Electronic Factory Inverter PCB Assembly 94V0 Rohs Custom PCBA service
Quick detail:
| Origin:China | Special: PCB Assembly |
| Layer:2 | Thickness:1.6mm |
| Surface: HASL-LF | Hole:0.8 |
Specification:
We also have ability for PCB layout ,PCBA and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement
Typical Applications
SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
Chip Programming
Conformal Coating
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
Parameter:
| o | Item | Data |
| 1 | Layer: | 1 to 24 layers |
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 | Board thickness: | 0.20mm to 3.4mm |
| 4 | Copper thickness: | 0.5 OZ to 4 OZ |
| 5 | Copper thickness in hole: | >25.0 um (>1mil) |
| 6 | Max. Board Size: | (580mm×1200mm) |
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) |
| 8 | Min. Line Width: | 3mil (0.075mm) |
| 9 | Min. Line Spacing: | 3mil (0.075mm) |
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue |
| 12 | Shape tolerance: | ±0.13 |
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 |
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 | Certificate: | UL,SGS,ISO 9001:2008 |
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA |
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling |
