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Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 6 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 66*76MM | Panel: | 1 |
| Surface: | Immersion Gold | ||
| High Light: | pcb manufacturing process,fr4 circuit board |
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Electrical 6 Layer PCB Printed Circuit Board for Equipments Impedance Control/UL/RoHS
Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
PCB Manufacturing Capabilities
Smallest drill size of 0.1mm (~4mil)
1 to 36 layers
FR4, Rogers, Taconic,Arlon,F4B
PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.
0.4 ounce to 4 ounce copper
Minimum Trace / Space of 3mil.
Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.
Board finish colors; Green, Blue, Black, Yellow, Red, White.
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Total Pad Size | Standard | Advanced |
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
| Turn Times | Selected Volume | Selected Solder Types |
| Same day through four weeks turns | No minimum order quantity | Leaded |
| Scheduled deliveries | Engineering prototypes | Lead-free/RoHS compliant |
| Low cost first article builds | No-clean process available | |
| Parts Procurement | Selected Stencils | Selected Ball Grid Arrays (BGA) |
| Turnkey | Laser cut stainless steel | As small as .5mm pitch |
| Kitted/Consigned | Nano-coating available | All BGA placements are x-ray inspected |
| Partial Turnkey | ||
| Assembly Types | Selected Component Types | Selected Other Capabilities |
| Surface Mount (SMT) | As small as 0402 package | Pitch components as small as 15 mil |
| Thru-hole | As small as 0201 with design review | Repair/Rework services |
| Mixed Technology (SMT/Thru-hole) | Mechanical Assembly | |
| Single or double sided placement | Box Build/Electromechanical Assembly | |
| Sub-assemblies |
