High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Board Size:||11*8cm||Board THK:||1.0mm|
|Cu THK:||35UM||Panel Size:||3*1|
Quick Turn Pcb Fabrication,
lead free pcb
Double Sided Microwave PCB Boards Radio Frequency For Defense Aerospace
|Base Material: Rogers 4003C|
|Surface finish: Immersion gold|
Radio frequency (RF) and microwave PCB’s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB’s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
|Min board thickness||2 layer 0.2mm|
|4 layer 0.4mm|
|6 layer 0.6mm|
|8 layer 0.8mm|
|10 layer 1.0mm|
|Max panel size||508*610mm|
|Board thickness tolerance||T≥0.8mm±8%,T＜0.8mm±5%|
|Wall hole copper thickness||＞0.025mm(1mil)|
|Min line width||4mil/4mil(0.1/0.1mm)|
|Min bonding pad space||0.1mm(4mil)|
|PTH aperture tolerance||±0.075mm(3mil)|
|NPTH aperture tolerance||±0.05mm(2mil)|
|Hole site deviation||±0.05mm(2mil)|
|Min buried blind via||0.2mm(8mil)|
|Outer cooper thickness||1oz-5oz|
|Inner cooper thickness||1/2 oz-4oz|
|SMT min green oil width||0.08mm|
|Min green oil open window||0.05mm|
|Insulation layer thickness||0.075mm-5mm|