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 Multilayer&High Frequency PCB 

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Home SamplesFR4 PCB

DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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FR4 PCB

  • High Precision FR4 PCB suppliers

Introduction:

High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.

 

Material:

(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

 

 

FAQ:

Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?

A:YES

 

 

 

FR4 PCB Sample Introduction

DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave

China DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave Supplier

Large Image :  DK 3.38 Rogers 4003C Custom PCB Circuit Board for Radio frequency / Microwave

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS
Model Number: XCEF

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union, L/C, MoneyGram
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Base Material: Rogers Solder Mask: Green
Board THK: 0.032 Inch Type: High Frequency
Board Size: 0.5*0.5 Cm Copper THK: 1OZ
Layer: 2 Min Line Space: 8mil
Min Line Width: 8 Mil Panel: 6*7
Origin: China Delivery: DHL,Fedex,TNT Etc.
High Light:

Quick Turn Pcb Fabrication

,

lead free pcb

DK = 3.38 Rogers 4003C RF / Microwave PCB Circuit Boards Maker
 

 

Technology:

 

Material

FR4(standard)

Isola 

FR4(Hi-Tg)

Isola / Nanya / ITEQ

Rogers

RO4003 /4350 /3010 /RT Duroid 5880 / 5870

Arlon

Diclad 25N / 25FR / 870 / 880

Taconic

TLY / TLC / RF35 / RF30

GETEK

RG200D / ML200D

Aluminum PCBs

Di-electric materials : FR4 / Bergquist / Rogers / Thermagon

Copper weight

1 ~ 5 oz  internal & external layers

Drilling

Min. Drilled Hole Size

10 mil ( 6 ~ 8 mil finished)

Annular Ring

5 mil(normal)    /    4 mil (for Laser vias)

Registration

± 3 mil

Max. Aspect Ratio

10 :1

Hole Size Tolerance

+/- 3 mils (PTH)  ;  +/- 2 mils (N-PTH)

Hole Roughness

< 0.8 mil

Min. Cu Plating in Holes

> 0.8mil,  Ave. 1 mil

 Laser drill

 available

Image Transfer

Min. Trace and space

4 / 4 mil

SMT / BGA.Pitch

10 mils for SMT   /    30 mils for BGA

Trace/space Tolerance

± 20%  (or +/- 10% per IPC class 3)

Solder Mask

LPI Solder Mask

Green(glossy or matte), Blue, Red, Black, Yellow

Via Plugging

min. 80% filled

Solder Mask ink

Taiyo & Tamura

Registration

± 2 mil

Min Solder Dam

2.5 mil

Thickness

0.5 ~1.5 mil

Silkscreen

White, Yellow, Black

Min. silkscreen width

8 mil

CNC Dimension

± 5 mil

Punch Dimension

± 4 mil

Blind Vias / Buried Vias

Yes

VIP (Via in Pad)

Yes (Non-conductive epoxy resin-filled or Cu filled)

Impedance control

 

± 10%

Surface Finish

HASL

200 ~ 500 μ"

Pb free HASL

100 ~ 500 μ"

Immersion Gold

1 ~ 5 μ"

Immersion Silver

6 ~ 12 μ"

Immersion Tin

25 ~ 40 μ"

Electolytic Gold

Yes

Gold Finger Plating

5 ~ 40 μ"

OSP(Entek)

yes

Solder Mask Coating Method

Silkscreen printing (Double or triple coatings available)

Carbon Ink

20 Ω

Peelable mask

Thickness = 0.3 mm

Pumice Pre-treatment

Available

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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