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Home SamplesRogers PCB

Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board

China Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board Supplier
Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board Supplier Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board Supplier

Large Image :  Digital Camera 3 Oz Copper Base FR4 PCB HDI PCBs With UL 4 Layer Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 4
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 119*58mm Panel: 1
Surface: ENIG
High Light:

pcb manufacturing process

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fr4 circuit board

FR4 PCB HDI PCBs for Digital Camera With UL 4 Layer Board
8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB
Key Specifications/Special Features:
Key Specifications
Number of layers: 4L
Base-material: FR4, TG150
Thickness: 1.8 mm+/-10%
Final-Cu: 35um
Impedance: No
Blind and buried via: Yes
Min. Drill hole: 0.25mm
Min. Line space: 0.127mm
Min. Line width: 0.127mm
Mech. treatment: Routing
Surface treatment: ENIG
Solder-mask: Green
Legend-Print: white
100% E-test: Yes
Reasonable price and professional services.
UL,SGS,ISO9001,ISO14001,RoHS and ISO TS16949
 
Specification:
FR4 PCB HDI PCBs for Digital Camera With UL 4 Layer Board
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.
 
 
Specification:
FR4 PCB HDI PCBs for Digital Camera With UL 4 Layer Board,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
 
Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate
 
Parameter:
 

oItemData
1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size: (580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance: ±0.13
13Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling

 
 


Items

Mass

Prototypes

Layers

1-8 Layers

1-20 Layers

Max. Panel Size

600*770mm( 23.62"*30.31")

600*770mm(23.62"*30.31") 500*1200mm(19.69"*47.24")

Max.Board Thickness

8.5mm

8.5mm

Min. Board Thickness

2L:0.3mm

2L:0.2mm

4L:0.4mm

4L:0.4mm

6L:0.8mm

6L:0.6mm

Min Inner Layer Clearance

0.1mm(4mil)

0.1mm(4mil)

Min Line width

0.1mm(4/4 mil)

0.075mm(3/3 mil)

Min Line space

0.1mm(4/4 mil)

0.075mm(3/3 mil)

Min.Hole Size

0.2mm(8mil)

0.15mm(6mil)

Min plated hole thickness

20um(0.8mil)

20um(0.8mil)

Min Blind/Buried hole size

0.2mm(8mil)

0.2mm(1-8layers)(8mil)

PTH Dia. Tolerance

±0.076mm(±3mil)

±0.076mm(±3mil)

Non PTH Dia. Tolerance

±0.05mm(±2mil)

±0.05mm(±2mil)

Hole Position Deviation

±0.05mm(±2mil)

±0.05mm(±2mil)

Heavy Coppe

4OZ/140μm

6OZ/175μm

Min S/M Pitch

0.1mm (4mil)

0.1mm (4mil)

Soldermask colour

Green,black,Blue,White,Yellow,Red

Green,black,Blue,White,Yellow,Red

Silkscreen colour

White,Yellow,Red,Black

White,Yellow,Red,Black

Outline

Routing,V-Groove, Beveling punch

Routing,V-Groove, Beveling punch

Outline Tolerance

±0.15mm ±6mil

±0.15mm (±6mil)

Peelable mask

Top,bottom,double sided

Top,bottom,double sided

Controlled Impedance

+/- 10%

+/- 7%

Insulation Resistance

1×1012Ω(Normal)

1×1012Ω(Normal)

Through Hole Resistance

<300Ω(Normal)

<300Ω(Normal)

Thermal Shock

3×10sec@288ºC

3×10sec@288ºC

Warp and Twist

≤0.7%

≤0.7%

Electric Strength

>1.3KV/mm

>1.4KV/mm

Peel Strength

1.4N/mm

1.4N/mm

Solder Mask Abrasion

>6H

>6H

Flammability

94V-0

94V-0

Test Voltage

50-330V

50-330V

 
Our Advantage:
2.Quick and econimic delivery term.
3.Provide PCB & PCBA prototype, and medium&low volumn quick board services.
4.Component purcharsing, SMT&PCBA one-stop source.
5.Two-hours quote response, 24 hours quick-turn produce.
6.FR4,Rogers,Taconic in 48 hours.
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)