Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Home SamplesRogers PCB

BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.


Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable

China BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable Supplier

Large Image :  BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 2
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 1OZ
Board Size: 55*75mm Panel: 1
Surface: HASL-LF
High Light:

fr4 circuit board


Custom Printed Circuit Board

BGA FR4 PCB Multilayer Board Woth Immersion Gold PCB Board Programmable Pcb Board



Quick detail:

Origin:China Special: FR4 Material
Layer:2 Thickness:1.6mm
Surface: HASL-LF Hole:0.5


The main parameters of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example)

Yellow and white core plate divided core material, usually white core material;

Sheet Size: 36 "* 48", 40 "* 48", 42 "* 48", 37 "* 49", 41 "* 49", 43 "* 49";

Thickness: 0.10mm, 0.10MM behind by increments, usually the thickest of 3.20mm, 0.30mm or less can do multilayer core board, 0.60MM surface treatment can not do the following HAL, complete the following press thickness 1.00mm thickness the thickness of ± 0.10,1.00mm by more than ± 10%;

Sheet copper thickness: 1 / 3OZ-12um, 1 / 2OZ-17.5um, 1OZ-35um, 2OZ-70um, 3OZ-105um, etc;

TG value: glass transition temperature, the material begins to be interpreted as a softening point of the glass as the temperature in the molten state. Normal TG (≤140 ℃), the TG (150 ℃), high TG (≥170 ℃)

CTI Definition: comparative tracking index; divided into six grades: 1 (CTI≥600V), 2 (600V> CTI≥400V), 3 (400V> CTI≥250V), 4 (249V> CTI≥175V), 5 ( 175V> CTI≥100V), 6 (100V> CTI≥0V);

Dielectric constant (Er): general value 4.2-4.5;

Thermal decomposition temperature (TD): typ. 305 ℃;


Model Number:XCEPCB005

Shipping port:ShenZhen/HongKong

Place of origin:GuangDong,China

Delivery Time:3-10 Working Days

Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union



The full name of Ball BGA Grid Array (BGA package), which is produced at the bottom of the ball array package substrate as the circuit I / O terminals and the printed circuit board (PCB) interconnected. Devices using the technology package is a surface mount device.



BGA package (Ball Grid Array Package) of I / O terminals are round or columnar pad matrix form distributed in the following packaging advantages of BGA technology is the I / O pin count, although increased, but did not pitch Save small but increased, thereby improving the assembly yield; although it increases the power consumption, but can be controlled collapse chip BGA welding method, which can improve its electric properties; thickness and weight than prior art encapsulation decreased ; reduce parasitics, the signal propagation delay is small, the frequency of use greatly increased; coplanar welding assembly is available, and high reliability.





o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling






• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program



Rogers material in stock:


Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2


Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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