Shenzhen Xinchenger Electronic Co.,Ltd

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 Multilayer&High Frequency PCB 

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Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

China Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module Supplier
Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module Supplier Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module Supplier

Large Image :  Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Product Name: Satcom Pcb Size: 32*16
Material: F4B Layer: 4
Color: Black Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 1.5OZ
High Light:

printed circuit board design

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printed circuit board pcb

Automotive Radar Detector High Frequency PCBs  With Sensor Module

 

 

Specification:

 


Board size: 32*16 cm                                              

                

Board thickness: 0.2mm

 

Copper foil: 50UM

 

Layer: 4

 

 

Parameter:

 

F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
 

 

Description:

 

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

 

 

Max panel size 508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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