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Introduction:
High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
Material:
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
FAQ:
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
A:YES
Product Details:
Payment & Shipping Terms:
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| Base Material: | Taconic | Solder Mask: | Black |
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| Board THK: | 0.8MM | Type: | High Frequency |
| Board Size: | 5*5 Cm | Copper THK: | 1OZ |
| Layer: | 2 | Min Line Space: | 8mil |
| Min Line Width: | 8 Mil | Panel: | 8*4 |
| Origin: | China | Delivery: | DHL,Fedex,TNT Etc. |
| High Light: | Quick Turn Pcb Fabrication,lead free pcb |
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Antenna HF High Frequency RF PCB Board Circuit Design With Taconic Material
Introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal. Look for board performance requirements, can be an ordinary FR4 epoxy glass fiber ,also be Teflon and other special microwave substrates.
RF board standards:
1, low-power RF PCB design, the main use of standard FR4 material (good insulation characteristics , uniform material, a dielectric constant ε = 4,10%).
2, RF of the PCB, the individual elements should be tight arrangement, to ensure that the shortest connection between the various elements.
3, for a PCB mixed-signal, RF and analog section should stay away from digital digital part (this distance is usually more than 2cm, at least 1cm), the digital part of the ground should be separated from the RF part.
4, the choice of working environment in the high frequency components, as far as possible the use of surface-mount devices. This is because the surface-mount components are generally small, the pin element is very short.
Others:
The basic requirements for the processing of high-frequency microwave board
1, the substrate,engineer has been based on the actual needs of the impedance, choose a specific permittivity, dielectric thickness, copper foil thickness,therefore, when accepting the order, to be carefully checked, must meet the design requirements.
2, The requirements of transmission lines making precision ,the high frequency signal transmission is very strict for the characteristic printed circuit board, that the production of precision requirements for the transmission line is ± 0.02mm , the edge of transmission line to be very neat, tiny burrs, nicks are not allowed to produce.
3, the characteristic impedance of the transmission line of high-frequency microwave board directly affects the transmission quality of the microwave signal. The size and thickness of the characteristic impedance of the copper foil has a certain relationship, especially for microwave board hole metallization, coating thickness only affects the total thickness of the copper foil, and affect the accuracy of engraved lead after pitting room, so the size of the coating thickness and uniformity, to be strictly controlled.
Application:
a Telecom: transmitter. Receiver. Oscillator. Antenna.
b Satellite receiver
c Global location system, amplifier, satellite telecom
d Microwave transmission
e Automobile telephone
f Measure apparatus, LSI inspector, analyser, signal oscillator
g High frequency teletcom, high speed transmission, high security, high transmission quality, high memory transaction
