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Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

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Taconic PCB

  • High Precision Taconic PCB suppliers

Introduction:

We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials

 

Sufficient stock:

We have sufficient rogers material raw as follow:

TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Taconic PCB Sample Introduction

Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper

China Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper Supplier
Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper Supplier Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper Supplier Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper Supplier Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper Supplier

Large Image :  Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Rogers Layer: 4
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 2OZ
Board Size: 55*105mm Panel: 1
Surface: ENIG Other: Impedance Control
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Pcb Board Prototype

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Pcb Design And Fabrication

Amateur Radio Antenna TG170 Rogers Material Pcb Without Soldermask , 2oz Finished Copper

 

Quick detail:

 

Origin:China Special: High frequency pcb
Layer:4 Thickness:0.79mm
Surface: ENIG Hole:0.2

 


Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .Immersion gold surface finish make the pcb 's conductive performance enhancements. Multilayer pcb design ,the precision of the pcb improves much more better . Low dielectric : 3 dielectric conductivity much more precision .

 

 

Typical Applications:

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure

The basic characteristics of high-frequency substrate material requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable, usually the smaller the better the signal transmission rate and the dielectric constant
Of the square root is inversely proportional to the high dielectric constant is likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
In general, the high frequency can be defined as the frequency of 1GHz or more.Now more high frequency circuit board substrate is fluoride Shito media
Substrate, such as polytetrafluoroethylene (PTFE), usually called Teflon, usually used in more than 5GHz. There are also used FR-4 or
PPO substrate, can be used between 1GHz ~ 10GHz products, the three high-frequency substrate properties are as follows.
At this stage of the epoxy resin, PPO resin and fluoride resin three types of high-frequency substrate materials, epoxy resin into
Of the fluorine-based resin is the most expensive, while the dielectric constant, dielectric loss, water absorption and frequency characteristics of the fluorine resin
Most preferably, the epoxy resin is poor. When the frequency of application of the product is higher than 10GHz, only fluorine resin printed board can be applied. Obviously
Easy to see, fluorine resin high-frequency substrate performance is much higher than other substrates, but its shortcomings in addition to high cost is poor rigidity, and thermal expansion
Expansion coefficient larger. For polytetrafluoroethylene (PTFE), in order to improve performance with a large number of inorganic materials (such as silica SiO2) or
Glass cloth as reinforcing fill material, to improve the rigidity of the substrate and reduce its thermal expansion. Also because of PTFE resin itself
Molecular inertia, resulting in not easy to combine with the copper foil is poor, it is necessary with the copper foil surface of the special surface treatment. Approach
On a PTFE surface for chemical etching or plasma etching to increase the surface roughness or in the copper foil with PTFE
Alkene resin layer between the adhesive layer to increase the bonding strength, but may have an impact on dielectric properties, the entire fluorine-based high-frequency circuit-based
The development of boards requires suppliers of raw materials, research units, equipment suppliers, PCB manufacturers and communication products manufacturers, etc.
Multi-cooperation, to keep up with the rapid development of high-frequency circuit board in this area needs

 

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

Electronic equipment is the development trend of high-frequency, especially in the wireless network, the growing development of satellite communications, information products to high
Speed ​​and high-frequency, and communications products to the capacity of large-speed wireless transmission of voice, video and data standardization.
Of the new generation products need high-frequency substrate, satellite systems, mobile phone base stations and other communications products must be used to receive high-frequency circuits
Board, in the next few years will inevitably rapid development of high-frequency substrate will be a lot of demand.
The basic characteristics of high-frequency substrate material requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable, usually the smaller the better the signal transmission rate and the dielectric constant
Of the square root is inversely proportional to the high dielectric constant is likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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