Shenzhen Xinchenger Electronic Co.,Ltd

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 Multilayer&High Frequency PCB 

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Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

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RF PCB

  • High Precision RF PCB suppliers

Introduction:

RF PCB introduction:

RF is Radio Frequency, referring to the radio, a high-frequency signal.

For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon and other dedicated microwave substrates.

 

 

RF board standards:

1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics

uniform material, dielectric constant ε = 4,10%).

2,In the RF PCB, every component should compact configuration to ensure that the shortest connection

between the every component.

3, For a mixed-signal PCB, RF and analog section should stay away from digital part

(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be

separated from the RF part.

4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.

RF PCB Sample Introduction

Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

China Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material Supplier

Large Image :  Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCET

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Taconic Layer: 4
Color: Black Min Line Space: 8mil
Min Line Width: 8mil Copper Thickness: 35um
Size: 15*6cm Board THK: 1.0MM
Panel: 1*1 Surface Finish: Immersion Silver
Model: XCET Brand: XCE
High Light:

pcb printed circuit board

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quick turn PCB

Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material

 

 

Introduction:

 

The increasing complexity of electronic components and switches continually requires faster 

signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times 

in electronic components, it has also become necessary for high frequency (HF) technology to

 view conductor widths as an electronic component. 

Depending on various parameters, HF signals are reflected on circuit board, meaning that the 

impedance (dynamic resistance) varies with respect to the sending component. To prevent such 

capacitive effects, all parameters must be exactly specified, and implemented with the highest level

 of process control. 

Critical for the impedances in high frequency circuit boards are principally the conductor trace 

geometry,the layer buildup, and the dielectric constant (er) of the materials used. 

 

 

Technology Sheet

 

Capabilities Standard Production Advanced Production
Layer Count / Technology 4 - 28 Layers 4 - 28 Layers
PCB Thickness Range 0.5 - 2.4 mm 0.32 - 2.4 mm
Build Up Core & Hybrid Build Up Core & Hybrid Build Up
Materials FR4 / Rogers / Taconic / others (Teflon based)

FR4 / Taconic / Rogers / 

others on request

Glass Transition Temperature 105℃ / 140℃/ 170℃  105℃/ 140℃/ 170℃ 
Standard Glass Cloth 106 / 1080 / 2116 / 1501 / 7628

1037 / 106 / 1080 / 2116 / 

1501 / 

7628

Copper Thickness 18μm / 35μm / 70μm

9μm / 18μm / 35μm / 

70μm

Copper Plating Holes 20μm (25μm) 13μm / 20μm/ 25μm
Min. Line / Spacing 100μm / 100μm 50μm / 50μm
Soldermask Registration ‘+/- 65μm(Photoimageable)

’+/- 25μm 

(Photoimageable)

Min. Soldermask Dam 75μm 60μm
Soldermask Color Green / white / black / red / blue

Green / white / black 

/ red / blue

Max. PCB Size 575 mm x 500 mm 575 mm x 500 mm
Production Panel 609.6 mm x 530 mm 609.6 mm x 530 mm
609.6 mm x 457.2 mm 609.6 mm x 457.2 mm
Min. Annular Ring 150μm 100μm
Smallest Drill 0.28 mm 0.15 mm
Smallest Routing Bit 0.8 mm 0.8 mm
Surfaces OSP / HAL Lead Free / Immersion Tin

OSP / HAL Lead Free / 

Immersion Tin

Immersion Ni/Au Immersion Ni/Au
Plated Ni/Au Plated Ni/Au
Immersion Ag Immersion Ag
Scoring Yes Yes
ID Print White White
Blue Mask & Carbon Print Yes Yes

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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