RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal.
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon and other dedicated microwave substrates.
RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.
Payment & Shipping Terms:
|Color:||Black||Min Line Space:||8mil|
|Min Line Width:||8mil||Copper Thickness:||35um|
|Panel:||1*1||Surface Finish:||Immersion Silver|
pcb printed circuit board,
quick turn PCB
Advanced Microstrip Patch Antenna PCB Board With Taconic RF Base Material
The increasing complexity of electronic components and switches continually requires faster
signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times
in electronic components, it has also become necessary for high frequency (HF) technology to
view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that the
impedance (dynamic resistance) varies with respect to the sending component. To prevent such
capacitive effects, all parameters must be exactly specified, and implemented with the highest level
of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace
geometry,the layer buildup, and the dielectric constant (er) of the materials used.
|Capabilities||Standard Production||Advanced Production|
|Layer Count / Technology||4 - 28 Layers||4 - 28 Layers|
|PCB Thickness Range||0.5 - 2.4 mm||0.32 - 2.4 mm|
|Build Up||Core & Hybrid Build Up||Core & Hybrid Build Up|
|Materials||FR4 / Rogers / Taconic / others (Teflon based)||
FR4 / Taconic / Rogers /
others on request
|Glass Transition Temperature||105℃ / 140℃/ 170℃||105℃/ 140℃/ 170℃|
|Standard Glass Cloth||106 / 1080 / 2116 / 1501 / 7628||
1037 / 106 / 1080 / 2116 /
|Copper Thickness||18μm / 35μm / 70μm||
9μm / 18μm / 35μm /
|Copper Plating Holes||20μm (25μm)||13μm / 20μm/ 25μm|
|Min. Line / Spacing||100μm / 100μm||50μm / 50μm|
|Soldermask Registration||‘+/- 65μm(Photoimageable)||
|Min. Soldermask Dam||75μm||60μm|
|Soldermask Color||Green / white / black / red / blue||
Green / white / black
/ red / blue
|Max. PCB Size||575 mm x 500 mm||575 mm x 500 mm|
|Production Panel||609.6 mm x 530 mm||609.6 mm x 530 mm|
|609.6 mm x 457.2 mm||609.6 mm x 457.2 mm|
|Min. Annular Ring||150μm||100μm|
|Smallest Drill||0.28 mm||0.15 mm|
|Smallest Routing Bit||0.8 mm||0.8 mm|
|Surfaces||OSP / HAL Lead Free / Immersion Tin||
OSP / HAL Lead Free /
|Immersion Ni/Au||Immersion Ni/Au|
|Plated Ni/Au||Plated Ni/Au|
|Immersion Ag||Immersion Ag|
|Blue Mask & Carbon Print||Yes||Yes|