High frequency pcb widely used in Mobile communication products,
amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet
PTFE + woven glass
Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50
Loss tangent (DF): 0.0030@10GHz
Copper adhesion: 12ibs / inch
Water absorption: ≤0.02%
Surface resistance: 1X1016 Ω
Volume resistivity: lXl012Ω
Thermal conductivity: 0.8 kcal / m / h ℃
Working temperature: -50 ~ + 260 ℃
Payment & Shipping Terms:
|Surface Finish:||Immersion Gold||Line Space:||10mil|
|PCB:||High Frequency PCB||Material:||Rogers 4003|
|Line Width:||10 Mil|
custom pcb printing,
printed circuit board pcb
|Base material||Rogers 4003C||Board THK||1.6mm|
|Surface finish||Immersion gold||Line space||10mil|
|Copper THK||3OZ||Line width||10 mil|
Rogers 4003 substrate
2 layer Rogers 4003 pcb material
Green solder mask,
white silk screen
a Telecom: transmitter. Receiver. Oscillator. Antenna.
b Satellite receiver
c Global location system, amplifier, satellite telecom
d Microwave transmission
e Automobile telephone
f Measure apparatus, LSI inspector, analyser, signal oscillator
g High frequency teletcom, high speed transmission, high security, high transmission quality, high memory transaction
Rogers 4003 PCB Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
· * Impedance control
· * Solder-ability detection
* Digital metallograghic microscope
· *AOI (Automated Optical Inspection)
High Frequency Rogers 6-layer PCB
Based on a variety of parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect towards the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest amount of approach manage.
Vital for the impedances in high frequency printed circuit boards are principally the conductor trace geometry, the layer buildup, along with the dielectric continuous (er) on the supplies applied.
Materials used for HF circuit boards
For many applications, it is sufficient to use Rogers material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.
Rogers 4003 PCB Parameter
|2||Max working panel area||457 x 610 mm|
|3||Min board thickness||4 layer: 0.40mm|
|6 layer: 0.80mm|
|8 layer: 1.00mm|
|10 layer: 1.20mm|
|4||Min trace width||0.10mm|
|6||Min hole diameter||0.20mm|
|7||Min Copper thickness in hole||0.020mm|
|8||PTH size tolerance||±0.05mm|
|9||NPTH size tolerance||±0.025mm|
|10||Hole position tolerance||±0.05mm|
|12||Min solder mask dam||0.08mm|
|13||Insulation resistance||1E+12Ω (normal condition)|
|14||Max Board thickness/Hole size Rate||'10:01|
|15||Thermal shock endurance||288 3 times in 10sec|
|16||Max Board twist and wrap||≤0.7%|
|17||High Vlotage endurance||1.3KV/mm|
|18||Copper foil peel off endurance||1.4N/mm|
|19||Hardness of resist ink||≥6H|
|Place of Origin:||China|
|Minimum Order Quantity:||1pcs|
|Price:||Please send gerber file for accurate price|
|Packaging Details:||Inner:vacuum packed bubble bag Outer:carton box|
|Delivery Time:||3-8 days|
|Payment Terms:||T/T,western union,paypal,L/C|
|Supply Ability:||1, 000, 000PCS/week|
0.21mm to 7.0mm
0.5 OZ to 7.0 OZ
Copper thickness in hole
>25.0 um (>1mil)
Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
UL, ISO 9001, ISO 14001
Buried and blind vias+controlled impedance +BGA
Punching, Routing, V-CUT, Beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
|Rogers||RO5880||0.254 0.508 0.762||2.20 ± 0.02|
1) We have professional research team.
2) No MOQ,small order are aslo welcome,From Prototype to Mass production.
3) All products are 100% tested working before sent to you.
4) One stop PCB solution
5) We have professional sales team, so please do not hesitate to contact us if you have any question