Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Home SamplesRogers PCB

8L Multilayer HDI FR4 Circuit Main Board PCB for Communication Electronics

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

Sufficient stock:

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

8L Multilayer HDI FR4 Circuit Main Board PCB for Communication Electronics

China 8L Multilayer HDI FR4 Circuit Main Board PCB for Communication Electronics Supplier

Large Image :  8L Multilayer HDI FR4 Circuit Main Board PCB for Communication Electronics

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 8
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 300*71MM Panel: 1
Surface: Immersion Gold
High Light:

pcb manufacturing process

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fr4 circuit board

8L Multilayer HDI FR4 Circuit Main Board PCB for Communication Electronics

 

Description:

We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.

F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material

FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.

 

Features:

>Glass-reinforced hydrocarbon and ceramic dielectric

>Excellent high frequency performance due to low dielectric tolerance and loss

>Stable electrical properties versus frequency

>Low Z-axis expansion and excellent dimensional stability

 

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger

About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

 

 

Parameter:

 

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

 

 

 

Layers 1-16 layers Min Board Thickness(2-layer) 0.2mm
Max Board Size 635 × 1100mm Min Board Thickness(4-layer) 0.6mm
Min Board Size 20 × 30mm Min Inner-layer Thickness 0.1mm
Min Trace 0.1mm Min Annular Ring 0.1mm
Min Space 0.1mm Min Hole Location Tolerance ±0.075mm
Min Hole Size 0.2mm Min Hole Size Tolerance ±0.05mm
Board Warp ≤ 1° Min Outer Dimension Tolerance ±0.1mm
Solder Mask Green, Yellow, Red, Black, Blue, White
Surface Finish HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
Acceptable file Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
CAM software Genesis, CAM350

 

 


 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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