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Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 | Layer: | 8 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 180*66mm | Panel: | 1 |
| Surface: | HASL-LF | ||
| High Light: | pcb manufacturing process,fr4 circuit board |
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8L Multilayer FR4 HDI Circuit Main Board 1.6MM Thickness 1oz Copper
Thickness
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:HASL-LF
Quick detail:
Origin:China
Special: FR4 Material
Layer:8
Thickness:1.6mm
Surface: HASL-LF
Hole:0.5
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
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| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
Parameter:
| Layer No. | 1-16 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% | ||||||||
| Wall hole copper thickness | ＞0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
Our PCB board manufacture
* PCB board file with parts list provided by customers
* PCB board made, circuit board parts purchased by us
* Electronic testing circuit board
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
· * Impedance control
· * Solder-ability detection
* Digital metallograghic microscope
· *AOI (Automated Optical Inspection)
Parameter:
| Annular Ring | 5 mil/side or Greater (Min. Design) |
| Finish Plating | Immersion Gold |
| Copper THK | 1oz |
| Trace/Space Width | 8 Mils or Greater |
| Drill Clearance | 0.1mm(laser drilling) |
| Plated Slots | 0.036 or Greater |
| Smallest Hole | 0.1mm or Greater |
| Test Jig | One-off cost |
| Tooling | Yes |
| Soldermask Type | LPI Glossy, LPI-Matte, SR1000 |
| Soldermask Color | Green, Red, Blue, Black, White, Yellow, |
| Legend Color | White, Yellow, Black, Red, Blue |
| CNC Route Point | Any |
| Minimum Route Width | 0.031” |
| Scoring | Straight Lines, Jump Scoring, Panel Edge to Edge, CNC* |
| Body Gold | HARD*, IMMERSION* (up to 50 MICRON GOLD) |
| Data File Format | Gerber 274x with embedder aperture |
| Fab. Drawing Format | DXF, HPGL, DWG, PDF, Gerber |
| E.T Testing | Flying Probe, Single Sided, 1up Plate, Clampshell, Net List |
| Counter Sink / Counter Bore | Availiable up to 0.250 Diameter |
What we need:
* Gerber files of the bare PCB
* Bill of materials to include: Manufacturer's part number, type of part, type of packaging,
component locations listed by reference designators and quantity
* Dimensional specifications for non-standard components
* Assembly drawing, including any change notices
* Final test procedures (if available)
