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Home SamplesHigh Frequency PCB

8 Layer High Frequency PCB RF Circuit Boards , Rogers 3003 1OZ Printed Circuit Board Design

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Good quality Multilayer PCB
Good quality Multilayer PCB
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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

8 Layer High Frequency PCB RF Circuit Boards , Rogers 3003 1OZ Printed Circuit Board Design

China 8 Layer High Frequency PCB RF Circuit Boards , Rogers 3003 1OZ Printed Circuit Board Design Supplier

Large Image :  8 Layer High Frequency PCB RF Circuit Boards , Rogers 3003 1OZ Printed Circuit Board Design

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Origin: China Size: 20*8 CM
Color: Gold Material: Rogers3003
High Light:

custom pcb printing

,

printed circuit board pcb

8 Layer High Frequency RF Circuit Board With Low Loss PCB Material 

 

 

Specification:

 

Brand: XCE
Model: XCEH
Board size: 20*8cm
Cu thickness: 1OZ
Material: rogers3003
Min line space&width: 5Mil

 

 

Description:

 

Nowadays, higher frequencies are applied to electronic circuits in a wide range of areas.

In order to meet the increasing demand for miniaturization and to utilize high frequency, higher-density PCBs are necessary.

 

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

 

 

Parameter:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254    0.508  0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

 

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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