Introduction:
We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials
Sufficient stock:
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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Material: | Rogers | Layer: | 4 |
---|---|---|---|
Min Line Space: | 5mil | Min Line Width: | 5mil |
Copper Thickness: | 1OZ | Board Size: | 55*55MM |
Panel: | 1 | ||
High Light: | Pcb Board Prototype,Pcb Design And Fabrication |
Xinchenger Electronics co.,Ltd established in 2002,
we have commited ourselves to manufacturing various of hi-frequency microwave pcb
and multi-layer board including fastest sample production.
Key Specifications/Special Features:
Keyword: Rogers PCB supplier, high frequency PCBs manufacturer from XCE
Layers: multi-layer
Board thicknesses: 0.8mm
Board thickness tolerance: around 5%
Minimum hole size: 0.2mm
Minimum track width/space: 0.075/0.075mm
Solder mask thickness: 0.01mm
Material: Rogers,F4B,Taconic,Isola,Teflon
Layer no: 1-16
Finished board thickness: 0.2 mm-3.5mm (8mil-138mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5oz-4oz (18um-144um)
Copper plating hole: 18-30um
Impedance control: ±10%
Warp and twist: 0.70%
Image:
Minimum trace width (a) 0.075mm (3 mil)
Minimum space width (b) 0.075mm (3 mil)
SMD pitch (a) 0.2mm (8 mil)
BGA pitch (b) 0.2mm (8 mil)
Solder mask:
Minimum solder mask dam (a) 0.0635 mm (2.5mil)
Soldermask Clearance (b)0.075mm (3 mil)
Minimum SMT pad spacing (c) 0.075mm (3 mil)
Solder mask thickness 0.0007"(0.018mm)
Holes:
Minimum hole size (CNC): 0.2mm (8 mil)
Minimum punch hole size: 0.9mm (35 mil)
Hole size: Tol(+/-)PTH: ±0.075m, NPTH: ±0.05mm
Hole position: Tol ±0.075mm
Plating:
HASL/lead free HASL: 2.5um
Immersion gold nickel: 3-7umAu:1-5u"
OSP: 0.2-0.5um
Certifications: RoHS, ISO 9001, SGS, UL
Item | Mass Production | Pilot Run Production |
Capacity | Capacity | |
Layer Counts | 1L—18L, HDI | 20-28 , HDI |
Material | High Frequency | |
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880,3003)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
FR4+Rogers | ||
Maximum Size | 610mm X 1200mm | |
Board Outline Tolerance | ±0.15mm | ±0.10mm |
Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
Minimum Line / Space | 0.10mm | 0.075mm |
Trace width Tolerance | 15%-20% | 10% |
Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
Minimum laser hole | 0.1mm | 0.075mm |
Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
Mini hole ring (single | 0.075MM | 0.05MM |
OutLayer Copper Thickness | 17um--175um | 175um--210um |
InnerLayer Copper Thickness | 17um--175um | 175um--210um |
Mini Solder Mask Bridge | 0.05mm | 0.025mm |
Impedance Control Tolerance | ±10% | ±5% |
Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
Plated gold , OSP, Carbon ink, | ||
1-2L Lead-time | 3-7 days | 1-2 days |
4- 8L Lead-time | 7-10 days | 2-7 days |
10-18L Lead-time | 10-15 days | 4-9 days |
20-28L Lead-time | 15-20 days | |
Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> |