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Introduction:
Aluminum PCB/Metal Core PCB/MCPCB
Among all Metal core PCBs(MCPCBs,known for their ability to provide effective thermal dissipation for electronic products), Aluminum PCBs is the most common type-the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.Aluminum PCBs printed by us are widely used for LED lighting, power equipment and automotive systems.
We can produce 1Layer, 2Layer ,4 Layer and 6l ayer Aluminum PCB.Multilayer aluminum PCB is mainly used by high power industria products,Like outdoor Led screen .
Aluminum Core materials:
Peeling strength (n/mm):1.8
Insulation resistance (ω):>1*10 g
Breakdown voltage (vdc):>2 k
Soakable soldering (°C/m):280°C/260°C,1 min,no bubble&delamination
Thermal conductivity (ω/m-k):>0.8
Thermal resistance (°C/ω):< 1.2
Combustibility:fv-o
Dielectric constant (1mhz):4
Dielectric loss angle (tangent):0.03
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 High TG PCB | Layer: | 4 |
|---|---|---|---|
| Color: | GREEN | Min Line Space: | 10mil |
| Min Line Width: | 10mil | Copper Thickness: | 1OZ |
| Size: | 6*4 Cm | Board THK: | 1.6MM |
| Panel: | 3*4 | Surface Finish: | Immersion Gold |
| Model: | XCEH | Brand: | XCE |
| High Light: | pcb maker,printed circuit board manufacturing |
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4 Layer Circuit Boards High TG PCB High Thermal Conductivity Specification
Testing Procedures For PCB Board:
We perform multiple quality assuring procedures before shipping out any PCB board.
These include:
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
Quotation Requirement :
a) Base material
b) Board thickness
c) Copper thickness
d) Surface treatment
e) color of solder mask and silkscreen
f) Quantity
Our Manufacturing Capability
| Item | Capability | Item | Capability |
| Layer | 1-12L | Min.Finished Hole | 0.1mm |
| Board Thickness | 0.3-3.2mm | PTH/NPTH Tolerance | ±0.076mm ±0.05mm |
| Laminate Type | FR-4 Halogen free High TG | Hole Cu.Thickness | ≥25μm |
| Laminate Brand | Shengyi,Nanya | Min.Dielectrical Thickness | 0.0635mm |
| CuFoil Thickness | 1/2 - 4oz | Layer Misregistration | ±0.076mm |
| Peel Strength | ≥12.3 N/cm | Min.Solder Mask Dam | 0.05mm |
| Max.Panel Size | 600mm * 700mm | Min.Legend Width | 0.10mm |
| Min.Line Width/Space | 0.075mm/ 0.075mm | Warp&Twist | ≤0.5% |
| Min.Annular Ring | ≥0.125mm | Aspect Ratio | 8:01 |
| Impedance Control | ±8% | Surface Finish | HAL LF,ENIG, |
| Imm.Tin/Silver,OSP |
