 |
|
|
|
|
Introduction:Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
|
| Material: | FR4 | Layer: | 4 |
|---|---|---|---|
| Color: | Green | Min Line Space: | 4mil |
| Min Line Width: | 4mil | Copper Thickness: | 1OZ |
| Board Size: | 275*60MM | Panel: | 1 |
| Surface: | Immersion Gold | ||
| High Light: | pcb manufacturing process,fr4 circuit board |
||
4 Layer Panel FR4 PCB Inverter PCB Design
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness ＞0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance ＞1012Ωnormal
Through-hole resistance ＜300Ωnormal
Electric strength ＞1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity ＞6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer |
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 |
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
|||||
| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Total Pad Size | Standard | Advanced |
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
| Layers | 1-16 layers | Min Board Thickness(2-layer) | 0.2mm |
| Max Board Size | 635 × 1100mm | Min Board Thickness(4-layer) | 0.6mm |
| Min Board Size | 20 × 30mm | Min Inner-layer Thickness | 0.1mm |
| Min Trace | 0.1mm | Min Annular Ring | 0.1mm |
| Min Space | 0.1mm | Min Hole Location Tolerance | ±0.075mm |
| Min Hole Size | 0.2mm | Min Hole Size Tolerance | ±0.05mm |
| Board Warp | ≤ 1° | Min Outer Dimension Tolerance | ±0.1mm |
| Solder Mask | Green, Yellow, Red, Black, Blue, White | ||
| Surface Finish | HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP | ||
| Board Material | FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic | ||
| Acceptable file | Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD | ||
| CAM software | Genesis, CAM350 | ||
