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4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes

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HDI PCB

  • High Precision HDI PCB suppliers

Introduction:
HDI-HIGH DENSITY INTERCONNECT,HDI PCB Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

 

There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

 

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper.

 

 

HDI PCB Structures:
1. 1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
2. i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3. Copper filled stacked microvia structures are commonly seen in challenging designs.
4. Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

HDI PCB Sample Introduction

4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes

China 4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes Supplier
4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes Supplier 4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes Supplier 4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes Supplier

Large Image :  4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEHDI PCB

Payment & Shipping Terms:

Minimum Order Quantity: 1pc
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 PCB Layer: 1-28layers
Min. Hole Size: 6mil Board Size: Min 6 X 6mm | Max 457 X 610m
Surface Finishing: ENIG, Immersion Silver, Etc. Copper Thickness: 0.5oz - 2.0oz
Assembly Option: Yes Electronics Source: Yes

What is HDI PCB
High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.

 

By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

 

HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices.

 

Advantages of HDI PCB
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

 

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

 

Function improved by HDI PCB:

1.Denser trace routing

2.More stable power

3.Reduce interference inductance and capacitance effects

4.Improve signal integrity in high-speed design

Accelerate Development with HDI Printed Circuit Boards

1.Easier to place SMD components

2.Faster routing

3.Reduce frequent relocation of components

4.More component space (also by Via-in-Pad)

 

Feature

Capability

Number of Layers

4-30 layer

Quality Grade

IPC 6012 Class 2,IPC 6012 Class 3

Material

Tg 140°C FR4,Tg 150°C FR4,Tg 170°C FR4 ,Special material

Thickness

0.4-6.0mm

Min Track/Spacing

2-8mil

Min Hole Size

0.15mm-0.3mm

Solder Mask

Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green

Silkscreen

White, Black,Yellow,Blue

Surface Finish

Immersion gold,OSP,Hard gold,Immersion Silver

Finished Copper

0.5-13oz

Build time

5-10 days

Lead tim

2-3 days

4 Layer High Density Interconnector PCB With 480x580mm Maximum Panel Size Blind/Buried Holes

The digital world is getting complex hour by hour whereas the hardware associated with it is getting drastically smaller. The advantages of HDI PCBs are numerous, starting with more interconnections in smaller areas. This results in the miniaturization of boards that can be used in many applications.

 

Your computers are no longer heavy. They are sleek and sexy. You can work on your laptop and keep your business running while you board a flight. You can also watch your favorite action movie on your smartphone, some of which are way powerful than your laptops. Or you can just plug in your wireless headphones and get into the groove. Mankind is fond of electronics and it has become a part of our lives. In this era, all the electronic devices are designed for portability. Electronic devices are being designed for human convenience. All this was possible because of the miniaturization of the components and PCBs inside the electronic devices.

 

The PCB industry plays a prominent role in the development of all the electronic gadgets. Let it be a pacemaker in someone’s chest or the motherboard in a programmer’s workstation, PCB made it possible for creating crucial electronic devices.

 

As the size of the components shrinks, printed circuit board manufacturers adapted to the changing trends. This led to the birth of HDI design. This has made PCBs smaller, denser with higher component count, and faster.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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