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Home SamplesHigh Frequency PCB

2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask

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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask

China 2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask Supplier

Large Image :  2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: High Frequency Material Layer: 2
Color: Blue Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 2OZ
Board Size: 179*66mm Panel: 1
Surface: Immersion Tin
High Light:

custom pcb printing

,

printed circuit board pcb

 

 

2OZ Immersion Tin High Frequency pcb double layer 0.79mm Thickness Blue Soldermask

 

 

Electronic equipment is the development trend of high-frequency, especially in the wireless network, the growing development of satellite communications, information products to high
Speed and high-frequency, and communications products to the capacity of large-speed wireless transmission of voice, video and data standardization.
Of the new generation products need high-frequency substrate, satellite systems, mobile phone base stations and other communications products must be used to receive high-frequency circuit
Board, in the next few years will inevitably rapid development of high-frequency substrate will be a lot of demand.
 

Advantage
 
F4B High Frequency PCB Double Layer 0.79mm Thickness Blue Soldermask
 
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

Choosing high frequency pcb material :

Selecting a circuit material for a high-frequency printed-circuit board(pcb) is generally a trade-off,
often between price and performance.However,PCB materials are also selected by two key factors:
how well they meet the needs of an end-use application
and what kind of efforts is required to fabricate a desired circuit with a particular material.
These two factors may not mesh:one material may be well suited for a particular application
but may pose challenges in terms of circuit fabrication,and vice verse.
There is no foolproof,step by step procedure for selecting a PCB material.
But by relying on some tangible guildelines designed to evaluate a material in terms of its suitability
for circuit fabrication and for meeting the requirements of an application,
the process of selecting a PCB for a particaular application can be simplied.

 
Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling


 
Rogers material in stock:

 

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 
 

Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. karen

Tel: 86-755-26055813

Fax: 86-755-26055946

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