Introduction:
We have RF and microwave processing experience, we fully understand your PCB's request. Our engineers studied a variety of RF composite materials, know each performance and processing characteristics, which is the basic foundation of good RF microwave processing. Our material suppliers TACONIC have fast delivery time and quick response service prototype and production requirements, increase your speed to market and competitiveness. There are machining RF and microwave good experience, we can process all kinds of PTFE and other materials
Sufficient stock:
We have sufficient rogers material raw as follow:
TLY-5A TLY-5 TLY-3 HT1.5 TLX-0 TLX-9 TLX-8 TLX-7 TLX-6 TLC-27 TLE-95 TLC-30 TPG-30 TLG-30 RF-30 TSM-30 TLC-32 TPG32 TLG-32 TLG-34 TPG35 TLG-35 RF-35 RF-35A RF-35P RF-41 RF-43 RF-45 RF-60A CER-10
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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Surface Finish: | ENIG | Board THK: | 0.635 Mm |
---|---|---|---|
Product Name: | Rogers 6006pcb | Size: | 3*3 CM |
High Light: | Pcb Board Prototype,Pcb Design And Fabrication |
2 Layer Rogers Sensor PCB Duroid Ro6006 DK6.15 0.635mm High Frequency
Specification:
Brand: XCE |
Model: XCEr |
Board size: 3*3cm |
Cu thickness: 35UM |
Material: rogers |
Min line space&width: 5Mil |
Parameter:
Model | Parameter | thickness(mm) | Permittivity(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
RO4003 | 0.508 | 3.38 | |
TACONIC | TLF-35 | 0.8 | 3.5 |
TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
RF-60A | 0.64 | 6.15 | |
TLY-5 | 0.254,0.508,0.8 | 2.2 | |
TLC-32 | 0.8,1.5,3 | 3.2 | |
TLA-35 | 0.8 | 3.2 | |
ARLON | AD255C06099C | 1.5 | 2.55 |
MCG0300CG | 0.8 | 3.7 | |
AD0300C | 0.8 | 3 | |
AD255C03099C | 0.8 | 2.55 | |
AD255C04099C | 1 | 2.55 | |
DLC220 | 1 | 2.2 |
Description:
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Nowadays, higher frequencies are applied to electronic circuits in a wide range of areas.
In order to meet the increasing demand for miniaturization and to utilize high frequency, higher-density PCBs are necessary.