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Introduction:
Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section
Types:
2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.
Product Details:
Payment & Shipping Terms:
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| Material: | FR4 PCB | Color: | GREEN |
|---|---|---|---|
| Size: | 13*13cm | Surface: | HASL |
| Board THK: | 1.6mm | Copper THK: | 1OZ |
| High Light: | multi layered pcb,multilayer pcb manufacturing |
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High Quality FR4 Multilayer PCB For Air Condition Controller Manufacturer
1.1L aluminum PCB;
2.good quality,reasonable price;
3.quicker delivery;
4.better logistic service;
5.UL,SGS,ROHS,ISO9000
-- PCB Manufacturing Services
High quality PCB manufacturing
Military, space and commercial applications
Wide array of substrates
Small prototype runs
Large scale production runs
ENIG, Immersion Silver, Lead Free HASL
Edge plating, plated slots
Blind / Buried vias
Fast turn times
reasonable prices!
-- Good Quality: UL, SGS Test, RoHS Certification
-- 1-20 layer: FR-4 matirial
-- Lead time: 3-12 days
-- competitive Price
| Item | Specification | ||
| Material | FR-4 / Hi-Tg FR-4 / Lead free Materials(RoHS Compliant)/CEM-3/CEM-1/Aluminium | ||
| Layer | single layer,double layer,multi-layer(4-10) | ||
| Board Thickness | 0.3mm-3.0mm,+/-0.1mm(tolerance) | ||
| Copper Thickness | 1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5% | ||
| Impedance Control | ±10% | ||
| Bow and Twist MAX. | 0.75%(SMT) | ||
| Anti-strip | 0.88N/mm | ||
| Resistance | ≤20Ω | ||
| Reactance | 500V | ||
| Min. Value | |||
| Min. Trace/Space Width | 6 mil,+/-0.15mm(tolerance) | ||
| SMD Pitch | 10 mil | ||
| BGA Pitch | 20 mil | ||
| Min Pad Space | 4mil(SMT) | ||
| Plating Copper Thickness | 15um | ||
| Hole | |||
| Hole Size | 0.25mm--6.2mm | ||
| Hole Position Tolerance | ±0.1mm | ||
| PTH/NPTH Tolerance | ±0.15mm(dia.=0.4-1.4mm) | ||
| Pad Tolerance | ±0.1mm(dia.≥0.6mm) | ||
| Pad to hole/to pad Tolerance | ±0.05mm/±0.2mm | ||
| Solder Mask | |||
| Pad no Open | soldermask must cover all on both side, reject tin on pad |
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| Pad Open | reject soldermask inside the hole on both side |
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| Solder Mask Thickness | 0.7mil,raised H≤0.05 |
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| Colour | green,blue,red,yellow,black,white(LPI/MATT.,UL 94 V0 approved) | ||
| Surface Finish | |||
| HAL | tin height≤0.05mm |
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| ENIG | Nickel 3-7um,gold:0.5-0.7um | ||
| OSP/flash gold | 0.2-0.5um | ||
| Pealable mask | cover all on pad,thickness≥0.20mm |
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| Carbon Ink | cover all on trace,Value≤30Ω |
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| Outline | |||
| Outline Tolerance | ±0.2mm | ||
| Beveling | 30°,45° | ||
| V-cut position/depth | ±0.2mm(length≤100mm)/±0.2mm | ||
| Punch | ±0.1mm | ||
| E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) | ||
| Certificate | SGS,ISO,ROHS,UL, | ||
