Introduction: Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2 Layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section   Types: 2-28 layer is available in our factory, Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.

Introduction: Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on.we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.   Sufficient stock: We have sufficient rogers material raw as follow:RO4003C,RO4350B,RO4360,RO4533,RO4535,RO4730,RO4232,RO4233,RO3003,RO3006,RO3010,RO3035,RO3203,RO3206,RO3210,RO3730,RO5780,RO5880,RO6002,RO3202,RO6006,Frequently-used is 4003C,4350B,5880 So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Introduction: High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization. Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.   Material: (1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate (2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss (3) Consistent with the thermal expansion coefficient of copper (4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture. (5) Other heat resistance,chemical resistance, impact strength, peel strength, etc. must also be good.   FAQ: Q:How to get a PCB prototype quotation? A:1.PCB Gerber file 2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment) Q:Is your tooling cost one-off payment? A:YES

Introduction: HDI PCB Boards contain blind and/or buried vias and often contain microvias of.006 or less in diameter. They have a higher circuitry density than traditional circuit boards.   There are 6 different types of HDI PCB boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias,passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.   HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, Xinchenger uses laser-drilled microvias electroplated with copper. HDI PCB Structures: 1.1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers. 2.i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. 3.Copper filled stacked microvia structures are commonly seen in challenging designs. 4.Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.

Introduction: We also have ability for PCB layout,PCBA  and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement   Material: SMD package, Chip-on-board and Flip Chip assembly technique 0201 chip, Micro BGA, u-BGA, QFN and LGA assembly AI and Thru-hole assembly RoHS, REACH compliance and Lead-Free solder technology Chip Programming Conformal Coating ICT test and AOI inspection ESD Protection Control Procedure IPC-A-610E Class II and Class III Workmanship Standard

Introduction: Aluminum PCB/Metal Core PCB/MCPCB Among all Metal core PCBs(MCPCBs,known for their ability to provide effective thermal dissipation for electronic products),Aluminum PCBs is the most common type-the base material consists of aluminum core with standard FR4.It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products.Currently,Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.Aluminum PCBs printed by us are widely used for LED lighting, power equipment and automotive systems. We can produce 1Layer,2Layer,4 Layer and 6 layer Aluminum PCB.Multilayer aluminum PCB is mainly used by high power industria products,Like outdoor Led screen.   Aluminum Core materials: Peeling strength (n/mm):1.8 Insulation resistance (ω):>1*10 g Breakdown voltage (vdc):>2 k Thermal conductivity (ω/m-k):>0.8 Thermal resistance (°C/ω):< 1.2 Combustibility:fv-o Dielectric constant (1mhz):4 Dielectric loss angle (tangent):0.03