Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Electro Mechanical PCB Assembly PCBA for Equipment Control Mixed

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

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PCB Assembly

  • High Precision PCB Assembly suppliers

Introduction:


We also have ability for PCB layout ,PCBA  and Circuit assembly, specializes in producing the various electronic products based on your customized designs and do pcba,pcb assembly for all kinds of small ,medium Volume electronic products
Enabling you to focus on product development and sales, we can solve your production technology issues and take care of product quality
The operation we can handle for you is from the Bare pc board fabrication, full component procurement, SMT/BGA/DIP assembly, mechanical/case assembly, rubber molding, functional testing, repair, inspection of finished goods to shipment arrangement

 

Material:


SMD package, Chip-on-board and Flip Chip assembly technique
0201 chip, Micro BGA, u-BGA, QFN and LGA assembly
AI and Thru-hole assembly
RoHS, REACH compliance and Lead-Free solder technology
Chip Programming
Conformal Coating
ICT test and AOI inspection
ESD Protection Control Procedure
IPC-A-610E Class II and Class III Workmanship Standard

PCB Assembly Sample Introduction

Electro Mechanical PCB Assembly PCBA for Equipment Control Mixed

China Electro Mechanical PCB Assembly PCBA for Equipment Control Mixed Supplier

Large Image :  Electro Mechanical PCB Assembly PCBA for Equipment Control Mixed

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 2
Color: Green Min Line Space: 5mil
Min Line Width: 5mil Copper Thickness: 1OZ
Board Size: 200*105mm Panel: 1
Surface: HASL-LF


Electro Mechanical Assembly PCBA for Equipment Control Mixed PCB Assembly
Quick detail:

Origin:China Special: PCB Assembly
Layer:2 Thickness:1.6mm
Surface: HASL-LF Hole:0.8

 
 

Product Description
Supply OEM Electronic circuit board assembly with high quality
Material : FR4 94v0 tg-130
Layers (GERBER FILE) : 2 layers
Board Thickness : 1.6mm
Copper Thickness : 2oz
Surface Treatment :HASL-LF
Solder Mask : green
Silk Screen : white
Data File Format : gerber file andbill of material BOM
Board size: 200*105mm
Min. Hole Size : 0.15mm
Hole Size Tolerance : +/-0.05mm (2 mil)
Profile and V-Cut : v cut
Special Process : Embedded Capacity

 

 
PCB Assembly Details:
Standard Component Sourcing Service
Supplier →Components Purchase →IQC →Protection Control →Material Supply →Firmware
Technical Requirement for PCB Assembly:
v Professional Surface-mounting and Through-hole soldering Technology
v Various sizes like 1206,0805,0603,0402,0201 components SMT technology
v ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
v PCB Assembly With UL,CE,FCC,Rohs Approval
v Nitrogen gas reflow soldering technology for SMT.
v High Standard SMT&Solder Assembly Line
v High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
vProgram Management
PCB Files →DCC →Program Organizing →Optimization →Checking
vSMT Management
PCB Loader →Screen Printer →Checking →SMD Placement →Checking →Air Reflow →Vision Inspection →AOI →Keeping
vPCBA Management
THT→Soldering Wave (Manual Welding) →Vision Inspection →ICT →Flash →FCT →Checking →Package →Shipment
 
Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

PCB Assembly Capability
 

Quantity Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000
Type of Assembly SMT,Thru-hole, DIP
Solder Type Water Soluble Solder Paste,Leaded and Lead-Free
Components Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board Size Smallest:0.25*0.25 inches
Largest:20*20 inches
File Formate Bill of Materials
Gerber files
Pick-N-Place file
Types of Service Turn-key,partial turn-key or consignment
Component packaging Cut Tape,Tube,Reels,Loose Parts
Turn Time Same day service to 15 days service
Testing Flying Probe Test,X-ray Inspection AOI Test

 

 
 
 
 
 
 
 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

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