Shenzhen Xinchenger Electronic Co.,Ltd

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 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear Transponder

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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear Transponder

China 5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear Transponder Supplier

Large Image :  5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear Transponder

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: High Frequency PCB Layer: 2
Color: / Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 90*190mm Panel: 1
Surface: HASL-LF

5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear transponder
 
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
 
 
 
Specification:
 

Brand: XCE
Model: XCEH
Board size: 9*19cm
Cu thickness: 35UM
Material: High Frequency Material
Min line space&width: 4Mil

 
Advantage
5.8G Induction PCB High Frequency Board 1.6MM Radio Board Linear transponder
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
 
 
Parameter
 

XCE PCB technical specifications
MaterialHigh Frequency PCB
Layer No.2
Min board thickness

2 layer0.2mm
4 layer0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm

Max panel size508*610mm
Board thickness toleranceT≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness>0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300V
Min buried blind via0.2mm(8mil)
Outer copper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickless0.075mm-5mm
Taphole aperture0.2mm-0.6mm
Special technologyIndepedance,Blind buried via,thick gold,aluminum PCB
Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin,
Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 
Description :
RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics with electrical performance close to PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while utilizing the same processing method as standard epoxy/glass, RO4350B is available at a fraction of the cost of conventional microwave laminates. No special through-hole treatments or handling procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high power RF designs.
Description :
RT/duroid 5880 high frequency laminates are PTFE composites reinforced with glass microfibers.The randomly oriented microfibers result in exceptional dielectric constant uniformity.
The dielectric constant of these high frequency laminates is the lowest of all products, and low dielectric loss make them well suited for high frequency/ broad band applications where dispersion and losses need to be minimized. Because of its extremely low water absorption characteristics, RT/duroid 5880 laminates are ideal for applications in high moisture environments.
RT/duroid 5880 laminates are easily cut, sheared and machined to shape, and resistant to all solvents and reagents normally used in etching printed circuits or plating edges and holes. RT/duroid 5870 and 5880 laminates have the lowest electrical loss of any reinforced PTFE material, low moisture absorption, are isotropic, and have uniform electrical properties over frequency.
Description :
RT/duroid 6002 microwave materials are a low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
The thermal coefficient of dielectric constant is extremely low from -55oC to+150oC (-67°F to 302°F) which provides the designers of filters, oscillators and delay lines the electrical stability needed in demanding applications.
Description :
RT/duroid 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15 and RT/duroid 6010LM laminate has a dielectric constant of 10.2.
RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. They have tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.
 
RO3200 series material RO3203 (r = 3.02) and RO3210 (r = 10.2) two composition, suitable for application RO3000 series material but need better mechanical strength of the occasion. RO3200 series material is a combination of PTFE / ceramic with PTFE / woven fiberglass laminated, with good rigidity and RO3000 materials, the material in this series can also be produced with mixed FR4 multilayer MLB
Description :
RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

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