Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High Speed Electronics 4 layer PCB Circuit Board White solder mask

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PCB Board Fabrication

  • High Precision PCB Board Fabrication suppliers
  • High Precision PCB Board Fabrication suppliers

PCB single sided production process :

baking sheet (pre-sizing) - board cutting - before treatment - paste dry film - exposing - developing - Etching - Stripping - Appearance inspection (AOI) - front processing - solder resist inks - prebaked - exposure - development - after baking - character printing - baking - surface treatment (immersion tin, ENIG, OSP, selected according to customer demand) - visual inspection - shape cutting - visual inspection - packing - shipping

PCB Board Fabrication Sample Introduction

High Speed Electronics 4 layer PCB Circuit Board White solder mask

China High Speed Electronics 4 layer PCB Circuit Board White solder mask Supplier

Large Image :  High Speed Electronics 4 layer PCB Circuit Board White solder mask

Product Details:

Place of Origin: China
Brand Name: Rogers
Certification: ISO9001/TS16949/IPC/ROHS/UL
Model Number: 3006

Payment & Shipping Terms:

Minimum Order Quantity: 5piece
Price: USD 0.1-10 Pieces
Packaging Details: inner:vacuum-packed bubble bag outer: carton box
Delivery Time: 5-8 work days
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10000000Piece/Pieces per Month
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Detailed Product Description

 

High Speed Electronics 4 layer PCB Circuit Board White solder mask

 
 
Detailed Product Description
 
Model: XCEH Origin: Shenzhen
Size: 9*12cm Panel: 3*2
Brand: XCE Color: Green
 

 

 

Specification

  • 4 layer
  • White solder mask, 
  • Model:XCEH
  • Copper THK: 1OZ
  • Location: Shenzhen

High Frequency ENIG Blind/Buried Via  Multilayer Rogers 5880 PCB Circuit Board

 

The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.

Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.

Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.

 

Get a Production PCBs Quote

   Submit your PCB design

 

PCB production capability
Files Gerber, Protel, Powerpcb, Autocad, Orcad, Eagle,etc.
Material

FR-4, Hi-Tg FR-4, Lead free Materials 

(RoHS Compliant) , CEM-3, CEM-

1, 94V0,Aluminium, High frequency Material (Rogers, 

Teflon, Taconic)

Layer No. 1 - 28 Layers
Board thickness 0.0075"(0.2mm)-0.125"(3.2mm) 
Board Thickness Tolerance ±10%
Copper thickness 0.5OZ - 4OZ
Impedance Control ±10%
Warpage 0.075%-1.5%
Peelable 0.012"(0.3mm)-0.02’(0.5mm)
Min Trace Width (a) 0.005"(0.125mm)
Min Space Width (b) 0.005"(0.125mm)
Min Annular Ring 0.005"(0.125mm)
SMD Pitch (a) 0.012"(0.3mm)

pcb with green solder mask and

 LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)
Regesiter torlerance 0.05mm
Min Solder Mask Dam (a) 0.005"(0.125mm)
Soldermask Clearance (b) 0.005"(0.125mm)
Min SMT Pad spacing (c) 0.004"(0.1mm)
Solder Mask Thickness 0.0007"(0.018mm)
Hole size

0.01"(0.25mm)-- 

0.257"(6.5mm)

Hole Size Tol (+/-) ±0.003"(±0.0762mm)
Aspect Ratio 6:01
Hole Registration 0.004"(0.1mm)
HASL 2.5um
Lead free HASL 2.5um
Immersion Gold Nickel  3-7um  Au:1-3u''
OSP 0.2-0.5um
Panel Outline Tol (+/-) ±0.004''(±0.1mm)
Beveling 30°45°
V-cut 15° 30° 45° 60°
Surface finish

HAL, HASL 

Lead Free, Immersion gold, Gold plating, Gold finger,

 immersion silver, immersion Tin, OSP, Carbon ink,

Certificate  ROHS  ISO9001:2008  TS16949  SGS  UL  CE
Special requirements

Buried and blind vias, 

Impedance control, via plug, BGA soldering 

and gold finger

 

Materials used for HF circuit boards

 

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

 

Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital

 

 

High frequency:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254    0.508  0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2
 

 

 

Advantage

 

1. PCB factory directly

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

One stop PCB assembly services Samples in 2-3 days | Bulk orders in 1 week | 2-year warranties Complete OEM assembly performed in-house Handle all customer's needs for PCB assembly,

component purchasing, and other product assemblies 
We quote for clients within 3 working days 

Testing: PCBA in-circuit testing, PCBA function testing, AOI, X-ray inspection Experience range:

industrial, automotive, computing and storage And consumer, instrumentation, medical, networking, peripherals, telecommunications

 

Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
  
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
 
 
Up to now, Xingchenger has over 500 employees based in China, with well-trained staffs and professional working attitudes, we believe our effective solutions can satisfy our customers’ needs through manufacturing expertise and a culture of continuous improvement. culture of continuous improvement.

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

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