Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

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High TG PCB

  • High Precision High TG PCB suppliers

Introduction:


Circuit board must flame-retardance , at a certain temperature does not burn, only soften. At this temperature point is called the glass transition temperature (Tg point), this value is related to the PCB dimensional stability.
The higher of TG value, the better of pcb high temperature resistance

 

Type:


High TG 180 KINGBOARD material raw in run production,so small sample orders here is available,TG180/TG170/130 also have in stock.
If your products need operation under high temperature,please send us inquiry for that.
Then we will choose best solutions for you.

 

Structure:


We will manufaturer according your detail design,ususlly we can do 2-28 layer pcb circuit board.

 

Why choose us:


Fast PCB prototype, production time+delivery time maybe only 6 days within 24 hours quick sample service.
Prototype PCB, no min quantity required ,1pcs is OK!
One-off tooling charge, conducive to repeat order PCB .
Quick Turn PCB, get detailed and exact quotation within 1 hours.
Keep all costs to min and max our customers' benefits!
Low cost PCB, you can save money on your prototype production.

High TG PCB Sample Introduction

Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

China Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness Supplier

Large Image :  Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 4
Color: Green Min Line Space: 8mil
Min Line Width: 8mil Copper Thickness: 1OZ
Board Size: 150*62mm Panel: 1
Surface: ENIG

Hi-Speed & Hi-Density Design Immersion Gold PCB Electronic Equipment Circuit In 0.8mm Thickness

 

 

Quick detail:

Origin:China Special: FR4 Material
Layer:4 Thickness:1.6mm
Surface: ENIG Hole:0.8

 

 

Specification:

heavy copper PCB board

Model Number:XCEPCB0023

Shipping port:ShenZhen/HongKong

Place of origin:GuangDong,China

Delivery Time:3-10 Working Days

Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union

Certification:CE,ROHS,FCC,ISO9008,SGS,UL

 

 

Specification:

Hi-Speed & Hi-Density Design Immersion Gold PCB,High Tg represents: a high heat resistance. Usually high Tg of 130 degrees or more plates, excellent high Tg is generally greater than 170 degrees, moderate Tg greater than about 150 degrees, PCB boards normally Tg≥170 ℃, called high Tg PCB. With the rapid development of the electronics industry, especially in the computer as the representative of electronic products toward high performance, high multi-layered development requires a higher heat resistance as an important guarantee of PCB substrate material. The emergence and development of SMT, CMT, represented by high-density mounting technology, the PCB in a small aperture, fine lines, thin side, high heat resistance become increasingly dependent on the substrate support

 

 

Typical Applications

 

Hi-Speed & Hi-Density Design Immersion Gold PCB

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links
  • Automotive Radar and Sensors
  • low dielectric loss
  • RF Identification (RFID) Tags
  • The stability of the dielectric constant
  • An extremely low water imbibition
  • LNB’s for Direct Broadcast Satellites

Tg of the substrate is increased, PCB thermal resistance, moisture resistance, chemical resistance, stability and other characteristics will improve and improve. TG higher the value, the better the sheet temperature resistance, especially in the lead-free process, the high Tg applications more

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 

 

Features

 

 

• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

 

 

Rogers material in stock:

 

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 

 

 

 

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

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