Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2

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RF PCB

  • High Precision RF PCB suppliers

Introduction:

 

RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal. 
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon 
and other dedicated microwave substrates.

RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection 
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part 
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be 
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.

 

RF PCB Sample Introduction

Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2

China Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2 Supplier
Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2 Supplier Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2 Supplier

Large Image :  Multilayer RF PCB High Frequency , Microwave F4B Pcb Board 0.38 MM ER = 2.2

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE G1

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
Detailed Product Description
Color: Green Material: F4B Material
Layer: Multilayer Board Size: 21*21cm
Copper Thinknes: 2 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Gold Over Nickel, Carbon Print
Drill: Blind & Buried Vias Original: China
Name: F4B Pcb

Multilayer High Frequency RF Microwave F4B Pcb Board 0.38 MM ER = 2.2

 

 Products Details

 

We are the highest efficience pcb manufature here .

 

 

(1) Professional Manufacturer on PCB for about 10 years

(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.

(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification

 

Feature Parameter (in)
Surface processing Lead- Free HASL/Plating gold / immersion gold /Plating gold finger/OSP
Layers 1~24 layers
Copper Thickness O.5OZ~10OZ
Board Thickness Range 14~276mil
Min Hole Size 3mil
Impedance Control ±5%
Flammability 94V-0
Warp & Twist ≦0.7%
Thermal Shock 5×10Sec@288
Aspect Radio 18:1
Min Line Width/Space 2mil /2mil
PTH Dia. Tolerance ±2mil
NPTH Dia. Tolerance ±1mil
Hole Position Deviation ±3mil
Outline Tolerance ±4mil
S/M Pitch 3mil
HDI Capability Any layer

 

 

OME Manufature

 

a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.

b. Expert circuit board testing, high quality factory wholesale price

c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS

 

We offer our customers a wide range material and boards:

 

1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB

2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available

3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)

4. Aluminum PCB board thickness from 0.8mm-3.6mm

5. Quantity from prototype to volume production

6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing

 

 

 

 

 

Raw Material F4B
Layer Count Multilayer 
Board Thickness 0.38 mm
Copper Thickness 2 oz
Surface Finish Immersion Gold Over Nickle 
Solder Mask Green 
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 210*210mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 

 

PrePreg Material
 

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

    
 Compared Data : 

  Model ER Tanδ@ 1GHz Cter (ppm/℃)

CTE (X,Y)

(ppm/℃)

FR4 Normal 4.6 0.030 17  
FR4 PCL370(FR4-HTG) 4.3 0.0015 51 17
FR4 117 (FR4-HTG) 4.4 0.013   17
Park Neclo N4000-6-FC BC (FR4-HTG) 4.1 0.0015   16

 
 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Kico

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