Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

About Us
PCB Services
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesRF PCB

UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

I'm Online Chat Now


  • High Precision RF PCB suppliers



RF PCB introduction:
RF is Radio Frequency, referring to the radio, a high-frequency signal. 
For performance index of PCB, it can be an ordinary FR4 epoxy glass fiber and also Teflon 
and other dedicated microwave substrates.

RF board standards:
1,In the design of miniwatt RF PCB, main material is standard FR4 (Good insulation characteristics
uniform material, dielectric constant ε = 4,10%).
2,In the RF PCB, every component should compact configuration to ensure that the shortest connection 
between the every component.
3, For a mixed-signal PCB, RF and analog section should stay away from digital part 
(This distance is usually more than 2cm, at least 1cm), the digital part of the ground should be 
separated from the RF part.
4, To choose the components working in high frequency environment should use of surface-mount component as far as possible. Because the surface-mount component is small volume generally and the pin of component is very short.


RF PCB Sample Introduction

UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers

China UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers Supplier
UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers Supplier UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers Supplier

Large Image :  UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE GR

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
Contact Now
Detailed Product Description
Color: Green Material: Rogers Mixed Material
Layer: Multilayer Board Size: 48*35cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Gold Over Nickel, Carbon Print
Drill: Blind & Buried Vias Name: Rogers Mixed Fr4 Pcb

UHF Rogers RF Pcb Board With ER= 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers


 Products Details


Raw Material Rogers  
Layer Count Multilayer 
Board Thickness 1.524 mm
Copper Thickness 1 oz
Surface Finish Immersion Gold Over Nickle 
Solder Mask Green 
Silkscreen White
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 480*350 mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable


PCB Capability


Layer 1-30L
Material CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness 0.2-6mm
Max Finish Size 450*508mm
Min. Drill Hole Size 0.25mm
Min. Line Width 0.075mm(3mil)
Min. Line Spacing 0.075mm(3mil)
Surface finish HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness 0.5-4.0 Oz
Solder mask color green/black/white/red/blue/yellow
Inner packing Vacuum packing, Plastic Bag
Outer packing standard carton packing
Hole tolerance PTH:±0.076,NTPH:±0.05
Certificate ISO9001,SGS
Profiling punching Routing,V-CUT,Beveling




PrePreg Material

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane 0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

 Compared Data : 

  Model ER Tanδ@ 1GHz Cter (ppm/℃)



FR4 Normal 4.6 0.030 17  
FR4 PCL370(FR4-HTG) 4.3 0.0015 51 17
FR4 117 (FR4-HTG) 4.4 0.013   17
Park Neclo N4000-6-FC BC (FR4-HTG) 4.1 0.0015   16

Competitive Advantage:
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.




Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

Send your inquiry directly to us (0 / 3000)