Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

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Double Sided PCB

  • High Precision Double Sided PCB suppliers

Double sided have panel wiring on both sides. 
However, to use the wire of the both sides, must have proper circuit connected between them.
This bridge between the circuit is called guide hole (via). 
Guide hole is full of or coated metal on the PCB, it can be connected to the wire on both sides.
Because the double sided PCB's area is twice of the single sided, and wires can be interleaved with each other (connected around the other side), it is more suitable for complex circuit than single sided PCB.

 

Double Sided PCB Sample Introduction

High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

China High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas Supplier
High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas Supplier High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas Supplier

Large Image :  High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS,FCC,ISO9008,SGS,UL
Model Number: XCE Bh70

Payment & Shipping Terms:

Minimum Order Quantity: MOQ 1 Piece
Price: Negotiation
Packaging Details: 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Delivery Time: 5-10 working days
Payment Terms: T/T, Western Union
Supply Ability: 1000000 pieces per week
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Detailed Product Description
Color: Green Material: Rogers Material
Layer: Multilayer Board Size: 8*8cm
Copper Thinknes: 1 Oz Min Line Width: 4 Mil
Min Line Space: 4mil Surface Finish: Immersion Gold
Name: Rogers Pcb

High Frequency Double Sided Rogers Ro 6202 PCB For Global Positioning System Antennas

 

Quick Detail :

 

Type Pcb
Material Rogers
Layer 4
Size 8*8cm
Permittivity 2.5
Color Green
Surface Finish Immersion Gold
 


 
 
Features:

RT/duroid® 6202 Laminates

RT/duroid® 6202 high frequency circuit materials are a low loss and low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This often eliminates double etching to achieve tight positional tolerances.

 

 

Parameter:

 

Model Parameter thickness(mm) Permittivity(ER)
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

 

 
Description :

 

     Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.

Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger

 
 
Data : 

Layer 1 to 28 layers
Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness 0.21mm to 7.0mm
Copper thickness 0.5 OZ to 7.0 OZ
Copper thickness in hole >25.0 um (>1mil)

 

Size

Max. Board Size: 23 × 25 (580mm×900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

 

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

 

Tolerance

 

Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate UL, ISO 9001, ISO 14001
Special requirements Buried and blind vias+controlled impedance +BGA
Profiling Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.

 

 

 

 

Benefits:

  • Low loss for excellent high frequency performance
  • Extremely low thermal coeffi cient of dielectric constant
  • Tight εr and thickness control. • In-plane expansion coeffi cient matched to copper
  • Excellent electrical and mechanical properties
  • Very low etch shrinkage

Typical Applications:

  • Phase Array Antennas
  • High Reliability Complex Multilayer Circuits
  • Ground Based and Airborne Radar Systems
  • Commercial Airline Collision Avoidance Systems
  • Global Positioning System Antennas
  • Beam Forming Networks
  •  

Production Description :

 

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s

 
 
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
 
 
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

 
 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

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