Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesPCB Board Fabrication

4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

I'm Online Chat Now

PCB Board Fabrication

  • High Precision PCB Board Fabrication suppliers
  • High Precision PCB Board Fabrication suppliers

PCB single sided production process :

baking sheet (pre-sizing) - board cutting - before treatment - paste dry film - exposing - developing - Etching - Stripping - Appearance inspection (AOI) - front processing - solder resist inks - prebaked - exposure - development - after baking - character printing - baking - surface treatment (immersion tin, ENIG, OSP, selected according to customer demand) - visual inspection - shape cutting - visual inspection - packing - shipping

PCB Board Fabrication Sample Introduction

4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

China 4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication Supplier

Large Image :  4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008
Model Number: XCEF

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Base Material: ShengYi FR4 Name: Multilayer Pcb
Board Thickness: 1.2mm Copper THK: 1OZ
Board Size: 10*9cm Surface Finish: HASL

4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication ​
 
 
 
Quick detail:

Surface: Lead free HASLLayer number:4
Special technology:blind holeHole:PTH
Origin:ChinaModel:XCEF

 
Specification

PCB Type:

multilayer PCB

Layer :

4 layer

Min .Line Width/Space:

3mil/3mil

Min. Via Diameter:

0.3mm

Finish Thickness:

0.2mm

Surface Finish:

ENIG

Size:

10*9MM

Material:

fr4

Color:

blue

Application:

telecommunication

 
 
Parameter
 

Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 
 
 
High frequency PCB Introduce:
 
 

ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254    0.508  0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

 
 
 
Description:
 
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown. 
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.
 
 4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication
4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication
 
 
 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Kico

Send your inquiry directly to us (0 / 3000)