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Introduction:
Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.
Sufficient stock:
We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880
So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files
Product Details:
Payment & Shipping Terms:
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| Base Material: | RT5880 | Name: | Rogers PCB |
|---|---|---|---|
| Board Thickness: | 0.762mm | Copper THK: | 1OZ |
| Board Size: | 12*9cm | Surface Finish: | Immersion Gold |
RT5880 High Frequency Rogers PCB With TK 0.254 / 0.508 / 0.762mm DK 2.2
Specification
PCB Type: | Rogers PCB |
Layer : | 2 layer |
Min .Line Width/Space: | 3mil/3mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 0.2mm |
Surface Finish: | ENIG |
Size: | 12*9MM |
Material: | 5880 |
Color: | black |
Application: | aviation |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | ＞1012Ωnormal | ||||||||
| Through-hole resistance | ＜300Ωnormal | ||||||||
| Electric strength | ＞1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | ＞6H | ||||||||
| Thermal stress | 288℃20Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
High frequency PCB Introduce:
| Model | Parameter | thickness(mm) | Permittivity(ER) |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 | |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
| F4Bk | 0.8,1.5 | 2.65 | |
| F4B | 0.8 | 3.5 | |
| FE=F4BM | 1 | 2.2 | |
| Rogers | RO5880 | 0.254 0.508 0.762 | 2.20 ± 0.02 |
| RO4350 | 0.254 0.508,0.8,1.524 | 3.5 | |
| RO4003 | 0.508 | 3.38 | |
| TACONIC | TLF-35 | 0.8 | 3.5 |
| TLA-6 | 0.254,0.8,1,1.5, | 2.65 | |
| TLX-8 | 0.254,0.8,1,1.6 | 2.55 | |
| RF-60A | 0.64 | 6.15 | |
| TLY-5 | 0.254,0.508,0.8 | 2.2 | |
| TLC-32 | 0.8,1.5,3 | 3.2 | |
| TLA-35 | 0.8 | 3.2 | |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 | |
| AD0300C | 0.8 | 3 | |
| AD255C03099C | 0.8 | 2.55 | |
| AD255C04099C | 1 | 2.55 | |
| DLC220 | 1 | 2.2 |
Description:
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.
