Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Multilayer PCB

  • High Precision Multilayer PCB suppliers

Introduction:


Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section

 

Types:


2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.

Multilayer PCB Sample Introduction

High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

China High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance Supplier

Large Image :  High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag  outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Min Line Space: 0.2mm Min Line Width: 0.2mm
Copper Thickness: 2OZ Size: 11*2cm
Board THK: 1.0MM Panel: 5*1
Surface Finish: HAL Lead Free Color: Green
Material: FR4 High TG Model: XCEM

High TG Multilayer Copper Base PCB Circuit Boards Fabrication

 

 

Parameter:

 

 

PCB parameter
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

 

High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Kico

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