Shenzhen Xinchenger Electronic Co.,Ltd

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 Multilayer&High Frequency PCB 

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Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry

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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry

China Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry Supplier
Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry Supplier Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry Supplier

Large Image :  Satellite Communications High Frequency PCB Printed Circuit Board Design For Satcom Industry

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEH

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Board THK: 0.2mm Product Name: Satcom Pcb
Size: 23*12 Material: Rogers 3010 0.127mm

Satellite Communications High Frequency PCB Circuit Boards For Satcom Industry

 

 

Specification:

 


Board size: 23*12 cm                                              

                

Board thickness: 0.2mm

 

Copper foil: 3OZ

 

Layer: 2

 

Model: XCEH

 

 

Rogers material in stock:

 

Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2

 

 

Description:

 

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)

 

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Kico

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