Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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High Frequency Rogers PCB four Layer RF Rogers5880 Antenna Board

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

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Rogers PCB

  • High Precision Rogers PCB suppliers

Introduction:

 

Rogers high frequency pcb widely used in the area of high technologies like communication device,Electronics,Aerospace,Military industry and so on. we have accumulated abandunt experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,4G antena etc.

 

Sufficient stock:

 

We have sufficient rogers material raw as follow:RO4003C、RO4350B、RO4360、RO4533、RO4535、RO4730、RO4232、RO4233、RO3003、RO3006、RO3010、RO3035、RO3203、RO3206、RO3210、RO3730、RO5780、RO5880、RO6002、RO3202、RO6006,Frequently-used is 4003C,4350B,5880

So we can do pcb circuit board with your detail requirements in the case of you send us gerber files or any other files

Rogers PCB Sample Introduction

High Frequency Rogers PCB four Layer RF Rogers5880 Antenna Board

China High Frequency Rogers PCB four Layer RF Rogers5880 Antenna Board Supplier

Large Image :  High Frequency Rogers PCB four Layer RF Rogers5880 Antenna Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: Rogers Layer: 4
Min Line Space: 5mil Min Line Width: 5mil
Copper Thickness: 1OZ Board Size: 199*89MM
Panel: 1

Xinchenger Electronics In-House Rogers PCB Prototype Service

If you are in need of Rogers or RF PCB prototype services, Contact Xinchenger Electronics today. Our PCB design experts can deliver on your requirements for virtually any type of PCB prototype service use, from single Rogers,Taconic,F4B boards to double-sided Rogers,Taconic,F4B boards to high-technology blind and buried via boards, Xinchenger Electronics can provide your prototype quickly, efficiently and at a price you can afford.

 

Xinchenger Electronics is a leader in Rogers,Taconic,F4B and other RF PCB prototype service in China because of our attention to detail and commitment to quality. We fabricate a complete an accurate RF PCB prototype, creating a sample circuit board to your specifications, which your designers can then use to make changes and test the design before you begin the full manufacturing process. Failure to test and modify your design with an accurately fabricated PCB prototype could result in extremely costly errors down the road.

 

In simplest terms, an RF printed circuit board is working with what’s essentially a very high-frequency analog signal. Your RF signal can be almost any voltage and current level at any point in time, as long as it’s between your minimum and maximum limits.

 

RF and microwave printed circuit boards operate on a frequency and pass signals within a certain band. Band pass filters are used to transmit signals in the “band of interest,” and anything outside of this frequency range is filtered out. Bands can be narrow or wide and can be carried via high-frequency carrier waves.

 

RF printed circuit board suppliers and manufacturers require a mix of standard and specialty equipment for proper processing and manufacturing. Plasma etch machinery is one of the more significant requirements, because it can maintain high quality in the thru-holes with minimal deviance.

 

Laser direct imaging (LDI) equipment is also commonly used for RF circuits, because it serves better than traditional photo exposure tools. You’ll want an LDI backing to ensure that board manufacturing maintains an extremely tight trace width, as well as front-to-back registration requirements.

 

 

PC BOARD TECHNOLOGIES STANDARD PROTOTYPE ADVANCED
(HDI)
       
Up To 20 Layers Yes Yes Yes
Blind & Buried Vias Yes Yes Yes
Via In Pad Yes Yes Yes
Sequential Lamination Yes Yes Yes
Impedance Control Yes Yes Yes
Hybrids & Mixed Dielectrics Yes Yes Yes
Rigid Yes Yes Yes
Rogers&Taconic&Isola&F4B Yes Yes Yes
Conductive Hole Fill Yes Yes Yes
Edge Plating & Constellation Yes Yes Yes
Variety of Panel Sizes Available Yes Yes Yes
       
DIMENSIONS      
       
Maximum Panel Sizes 18” X 24”
(457mm X 609mm)
18” X 24”
(457mm X 609mm)
12’ X 18”
(305mm X 457mm)
Maximum Usable area 16” X 22”
(406mm X 559mm)
16” X 22”
(406mm X 559mm)
10.4” X 16”
(264mm X 406mm)
Minimum Board Thickness 0.030”  (0.762mm) 0.005”  (0.127mm) 0.005” (0.127mm)
Minimum Core Thickness 0.014” (0.356mm) 0.005” (0.127mm) 0.003” (0.076mm)
Thickness Tolerance ±10% ±8% ±7%
Dimensional Tolerance ±10 mil ±7 mil ±5 mil
       
COPPER PADS & TRACES      
Min Trace Width & Spacing 0.007”/0.007” (0.178mm/0.178mm) 0.005”/0.005” (0.127mm/0.127mm) 0.003”/0.003” (0.076mm/0.076mm)
Minimum SMD Spacing 0.004” (0.102mm) 0.004” (0.102mm) 0.004” (0.102mm)
Minimum SMD Pitch 0.008” (0.203mm) 0.008” (0.203mm) 0.008” (0.203mm)
Min Annular Ring – Via 0.005” (0.127mm) 0.004” (0.102mm) 0.003” (0.076mm)
Min Annular Ring – Component 0.007” (0.178mm) 0.005” (0.127mm) 0.003” (0.076mm)
Max Finish Cu Weight – Outer 8 OZ 20 OZ 40 OZ
Max Finish Cu Weight – Inner/td> 1 OZ 4 OZ 6 OZ
Minimum Pad Size For Testing 0.010” (0.254mm) 0.008” (0.203mm) 0.006” (0.152mm)
       
DRILLS      
Smallest Drill Diameter 0.012” (0.305mm) 0.008″ (0.203mm) 0.006″ (0.152mm)
Minimum Plated Hole Size 0.008″ (0.203mm) 0.006″ (0.152mm) 0.006″ (0.152mm)
Minimum Unplated Hole Size 0.008″ (0.203mm) 0.006″ (0.152mm) 0.006″ (0.152mm)
Tolerance of Plated Holes ±0.003″ (±0.076mm) ±0.002″ (±0.051mm) ±0.002″ (±0.051mm)
Tolerance of Unplated Holes ±0.002″ (±0.051mm) ±0.002″ (±0.051mm) ±0.001″ (±0.025mm)
Maximum PTH Aspect Ratio 5:1 8:1 10:1
       
Blind And Buried Vias      
Max Blind Via Aspect Ratio 5:1 8:1 10:1
Min Blind Via Hole Size 0.008″ (0.203mm) 0.008″ (0.203mm) 0.008″ (0.203mm)
Min Buried Via Hole Size 0.008″ (0.203mm) 0.008″ (0.203mm) 0.008″ (0.203mm)
       
Via In Pad      
Conductive Fill Yes Yes Yes
Non-Conductive Fill Yes Yes Yes
       
SURFACE FINISHES      
HASL Yes Yes Yes
ENIG Yes Yes Yes
ENENIG Yes Yes Yes
Immersion Silver Yes Yes Yes
Immersion Tin Yes Yes Yes
Lead Free HASL Yes Yes Yes
       
SOLDER MASK AND LEGEND      
Green, Red, Black, Yellow, Blue, White, Clear, Grey, Purple Yes Yes Yes
       
FABRICATION      
V-Score Yes Yes Yes
V-Score Angles 30° 30° 30°
Bevel Angles 15°, 30° and
45°
15°, 30° and
45°
15°, 30° and 45°
       
QUALITY AND TESTING      
Certifications      
ISO 9001:2015  Yes  Yes  Yes
UL E103209  Yes  Yes  Yes
IPC 6012, Class 1, 2 And 3  1 and 2  1 and 2  1 and 2
       
Test And Measurement      
ZMetrix TDR  Yes  Yes  Yes
Camtek AOI  Yes  Yes  Yes
CMI XRF  Yes  Yes  Yes
MicroCraft, ATG FPT  Yes  Yes  Yes
       
Electrical Test Ranges      
Continuity 5-80 Volts 5-80 Volts 5-80 Volts
Isolation 10M Ohm 10M Ohm 10M Ohm
Voltages 100 Volts 100 Volts 100 Volts
Controlled Impedance  ±10%  ±8%  ±7%
       
AVAILABLE REPORTS      
       
Microsection  Yes  Yes  Yes
Solderability  Yes  Yes  Yes
CTM via X-Ray Fluorescence  Yes  Yes  Yes
Time Domain Reflectrometry  Yes  Yes  Yes
COC & FIR  Yes  Yes  Yes

 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Ms. kico

Tel: 86-755-26055813

Fax: 86-755-26055946

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