Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias

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High Frequency PCB

  • High Precision High Frequency PCB suppliers

Introduction:

 

High frequency pcb widely used in Mobile communication products,

amplifier, low noise amplifier,GSM, CDMA, 3G smart antenna,splitters, diplexers, filters, couplers and other passive components, Performance:low loss,high dielectric constant and stable,can provide a small size sheet

 

Material:

 

PTFE + woven glass

Dielectric constant (DK): 2.55,2.65,2.75,2.85,2.95,3.00,3.30,3.50

Loss tangent (DF): 0.0030@10GHz

Copper adhesion: 12ibs / inch

Water absorption: ≤0.02%

Surface resistance: 1X1016 Ω

Volume resistivity: lXl012Ω

Thermal conductivity: 0.8 kcal / m / h ℃

Working temperature: -50 ~ + 260 ℃

High Frequency PCB Sample Introduction

Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias

China Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias Supplier
Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias Supplier Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias Supplier

Large Image :  Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: Teflon Layer: 2
Color: / Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 60*159mm Panel: 1
Surface: Immersion Silver

 

Microwave Custom High Frequency PCB Board with Copper Burried / Blind Hole , Vias

 

Specification:

 

High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.

High frequency materials are UL 94V-0 rated for active devices and high power RF designs.

 

 

Specification:

Brand: XCE
Model: XCEH
Board size: 6*15.9cm
Cu thickness: 35UM
Material: Teflon
Min line space&width: 5Mil

 


Advantage
F4B 2 Layer 1.6mm High Frequency Board Circuit boards For Mission Critical Electronic Systems
1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

 

 

Parameter:

PRODUCT’S DETAILS
Raw Material F4B
Layer Count 2-Layer
Board Thickness 1.6mm
Copper Thickness 35UM
Surface Finish Immerison Silver
Solder Mask /
Silkscreen /
Min. Trace Width/Spacing 0.075/0.075mm
Min. Hole Size 0.25mm
Hole Wall Copper Thickness ≥20μm
Measurement 60*159mm
Packaging Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
Application Communication,automobile,cell,computer,medical
Advantage Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
Certification UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 

 

We can offer production with high quality and competitive:

Item Mass Production Pilot Run Production
Capacity Capacity
Layer Counts 1L_18L, HDI 20-28 , HDI
Material FR4
Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880) Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc.
Material Mixed Laminate 4 layers -- 10 layers 12 layers
FR4+Ro4350 , Rogers3003+FR4
Maximum Size 610mm X 1200mm 1200 - 2000MM
Board Outline Tolerance ±0.15mm ±0.10mm
Board Thickness 0.125mm--6.00mm 0.1mm--8.00mm
Thickness Tolerance ( t≥0.8mm) ± 8% ±5%
Thickness Tolerance( t<0.8mm) ±10% ±8%
Minimum Line / Space 0.10mm 0.075mm
Trace width Tolerance 15%-20% 10%
Minimum Drilling Hole (Mechanical) 0.2mm 0.15mm
Minimum laser hole 0.1mm 0.075mm
Hole Position/hole Tolerance ±0.05mm PTH:±0.076MM NPTH:±0.05mm
Mini hole ring (single 0.075MM 0.05MM
OutLayer Copper Thickness 17um--175um 175um--210um
InnerLayer Copper Thickness 17um--175um 175um--210um
Mini Solder Mask Bridge 0.05mm 0.025mm
Impedance Control Tolerance ±10% ±5%
Surface Finishing HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver.
Plated gold , OSP, Carbon ink,
1-2L Lead-time 3-7 days 1-2 days
4- 8L Lead-time 7-10 days 2-7 days
10-18L Lead-time 10-15 days 4-9 days
20-28L Lead-time 15-20 days
Acceptable File Format ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc.
Quality Standards IPC-A-600F and MIL-STD-105D CHINA GB<4588>


Reference - our production capability for rigid PCB:
Layers: 1 to 28
Board finished thickness: 0.2 to 7.0mm
Materials: FR4,Rogers,Taconic
Max. finished board size: 23 x 25 (580 x 900mm)
Min. drilled hole size: 3mil (0.075mm)
Min. line width: 3mil (0.075mm)
Min. line spacing: 3mil (0.075mm)
Surface finish/treatment : HASL/HASL lead free,HAL, Chemicaltin, chemical gold
Immersion Silver/gold,OSP, gold plating
Copper thickness: 0.5-7.0oZ
Solder mask color: green/yellow/black/white/red/blue
Copper thickness in hole: >25.0μm (>1mil)
Inner packing: Vacuum packing/plastic bag
Outer packing: Standard carton packing
Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificates: UL, ISO 9001, ISO 14001, SGS, RoHS
Special requirements: buried and blind Vias + controlled impedance + BGA
Profiling: Punching, routing, V-CUT, beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products

 

 

Parameter

 

XCE PCB technical specifications
Material F4B
Layer No. 2
Min board thickness

2 layer0.2mm

4 layer0.4mm

6 layer 0.6mm

8 layer 0.8mm

10 layer 1.0mm

Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%.,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300V
Min buried blind via 0.2mm(8mil)
Outer copper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickless 0.075mm-5mm
Taphole aperture 0.2mm-0.6mm
Special technology Indepedance,Blind buried via,thick gold,aluminum PCB
Surface finish

HASL,Lead free HASL,Immersion Gold, Immersion Tin,

Immersion Silver,OSP ,ENIG ,Golden finger,Blue glue,Gold plating

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

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