Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Multilayer PCB

  • High Precision Multilayer PCB suppliers

Introduction:


Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section

 

Types:


2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.

Multilayer PCB Sample Introduction

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

China Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit Supplier
Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit Supplier Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit Supplier

Large Image :  Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: FR4 Layer: 6
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 66*66mm Panel: 1
Surface: ENIG

 

 

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

 

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating
 

 

Main Export Markets:
Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe
Specification:
Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.
 
Advantage Highlights

  • Specialized in 2- to 32-layer PCB
  • ISO 9001-, ISO 14001- and ISO/TS 16949-certified
  • Products are UL- and RoHS-certified
  • Partner for over 2000 small- and medium-scale customers
  • Two factory bases totaling 22,000 square meters
  • Less than 12-hours quick response to inquiries
  • Widely acclaimed and satisfying services
  • Over 66% of PCBs are exported to international markets

Parameter:
 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 


Place of Origin:

Guangdong China (Mainland)

Brand Name:

XCE

Model Number:

XCEPCB008

Base Material:

FR4

Copper Thickness:

0.3-3oz

Board Thickness:

0.3-6mm

Min. Hole Size:

0.2mm

Min. Line Width:

3mil

Min. Line Spacing:

3mil

Surface Finishing:

HASL, OSP, Immersion Gold/Au, Immersion silver, etc.

Solder mask:
Green
PCB Standard:

IPC-A-610 E Class II-III

Wrap and twist:

5%

Layer Count:

1-22

profiling punching:

Routing, V-CUT, Beveling

Max board size:

1200mm*600mm

Hole tolerance:

PTH:±0.075,NTPH:±0.05

PCB Tolerance of finished thickness:

±5%

PCB:

Customized

Product name:

pcb
 

 

Product Feature:

1. OEM&ODM are availble, different shape for your choice

2. Programmable, it can change different colors and lighting ways

3. Green and Energy saving, best for your lighting project


Why choose us

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, any your customized lightings we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information


Trade Terms
1. Payment: T/T in advance (Western Union is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shenzhen, Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PC

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

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