Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Multilayer PCB

  • High Precision Multilayer PCB suppliers

Introduction:


Double-sided pcb have one layer dielectric layer in the middle, both sides are traces layer. Multilayer PCB is a multilayer traces layer, a dielectric layer between each 2 layer, a dielectric layer may be made very thin layers . Multilayer circuit board having at least three conductive layers, wherein the outer surface 2layers, while the remaining one was synthesized in the insulating plate. Electrical connection between them is usually done by plated through holes in the circuit board on the implementation of the cross section

 

Types:


2-28 layer is available in our factory,
Multilayer pcb use in professional electronic equipment (computers, military equipment), especially in the case of the weight and volume overload. In high-speed circuits, the multi-substrate is also very useful, they can provide more than two layer boards for the printed circuit board designers to laying cable, and provides a large area of ground and power.

Multilayer PCB Sample Introduction

Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security

China Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security Supplier

Large Image :  Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
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Detailed Product Description
Material: FR4 Layer: 8
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 189*19mm Panel: 1
Surface: ENIG

 

 

Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security

 

8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB

Key Specifications/Special Features:
Key Specifications

Number of layers: 8L
Base-material: FR4, TG150
Thickness: 1.8 mm+/-10%
Final-Cu: 35um
Impedance: No
Blind and buried via: Yes
Min. Drill hole: 0.25mm
Min. Line space: 0.127mm
Min. Line width: 0.127mm
Mech. treatment: Routing
Surface treatment: ENIG
Solder-mask: Green
Legend-Print: white
100% E-test: Yes

Reasonable price and professional services.
UL,SGS,ISO9001,ISO14001,RoHS and ISO TS16949

 

Main Export Markets:
Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe


Specification:
8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.

 

 

Specification:

8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB,

FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.

 

Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate

 

Parameter:

 

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size:  (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance:  ±0.13
13 Hole tolerance:  PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling

 


Place of Origin:

Guangdong China (Mainland)

Brand Name:

XCE

Model Number:

XCEPCB008

Base Material:

FR4

Copper Thickness:

0.3-3oz

Board Thickness:

0.3-6mm

Min. Hole Size:

0.2mm

Min. Line Width:

3mil

Min. Line Spacing:

3mil

Surface Finishing:

HASL, OSP, Immersion Gold/Au, Immersion silver, etc.

Solder mask:
Green
PCB Standard:

IPC-A-610 E Class II-III

Wrap and twist:

5%

Layer Count:

1-22

profiling punching:

Routing, V-CUT, Beveling

Max board size:

1200mm*600mm

Hole tolerance:

PTH:±0.075,NTPH:±0.05

PCB Tolerance of finished thickness:

±5%

PCB:

Customized

Product name:

pcb
 

 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

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