High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Color:||Black||Min Line Space:||4mil|
|Min Line Width:||4mil||Copper Thickness:||1OZ|
Multilayer Rigid PCB/ Hiigh-Density 8-Layer PCB PLC Power Circuit Board
|Origin:China||Special: FR4 Material|
Electronic Scale PCB With 0.8mm Thickness 94V0 Electronic Board Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
BGA's full name Ball Grid Array (solder ball array package), which is in the bottom of the package substrate array solder ball as the circuit I / O terminals and printed circuit board (PCB) interconnection. The device using this technology is a surface mount device package.
PBG (Plastic Ball Grid Array), which uses BT resin / glass laminate as the substrate, plastic (epoxy molding compound) as the sealing material, solder ball can be divided into lead solder (63Sn37Pb, 62Sn36Pb2Ag) and lead-free solder Sn96.5Ag3Cu0.5), solder ball and package connections do not require additional use of solder.
|1||Layer:||1 to 24 layers|
|2||Material type:||FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers|
|3||Board thickness:||0.20mm to 3.4mm|
|4||Copper thickness:||0.5 OZ to 4 OZ|
|5||Copper thickness in hole:||>25.0 um (>1mil)|
|6||Max. Board Size:||(580mm×1200mm)|
|7||Min. Drilled Hole Size:||4mil(0.1mm)|
|8||Min. Line Width:||3mil (0.075mm)|
|9||Min. Line Spacing:||3mil (0.075mm)|
|10||Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|11||Solder Mask Color:||Green/Yellow/Black/White/Red/Blue|
|13||Hole tolerance:||PTH: ±0.076 NPTH: ±0.05|
|14||Package:||Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing|
|16||Special requirements:||Buried and blind vias+controlled impedance +BGA|
|17||Profiling:||Punching, Routing, V-CUT, Beveling|
|1||Layers||Single Sided,2 to 18 Layer|
|2||Board material type||FR4,Rogers,Taconic,F4B,Isola,Nelco and more|
|3||Compound material lamination||4 to 6 layers|
|4||Maximum dimension||610 x 1,100mm|
|6||Board thickness coverage||0.2 to 6.00mm|
|7||Board thickness tolerance||Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
|8||DK thickness||0.076 to 6.00mm|
|9||Minimum line width||0.10mm|
|10||Minimum line space||0.10mm|
|11||Outer layer copper thickness||8.75 to 175µm|
|12||Inner layer copper thickness||17.5 to 175µm|
|13||Drilling hole diameter (mechanical drill)||0.25 to 6.00mm|
|14||Finished hole diameter (mechanical drill)||0.20 to 6.00mm|
|15||Hole diameter tolerance (mechanical drill)||0.05mm|
|16||Hole position tolerance (mechanical drill)||0.075mm|
|17||Laser drill hole size||0.10mm|
|18||Board thickness and hole diameter ratio||10:01|
|19||Solder mask type||Green, Yellow, Black, Purple, Blue, White and Red|
|20||Minimum solder mask||Ø0.10mm|
|21||Minimum size of solder mask separation ring||0.05mm|
|22||Solder mask oil plug hole diameter||0.25 to 0.60mm|
|23||Impedance control tolerance||±10%|
|24||Surface finish||Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger|
|25||Certificate||ROHS, ISO9001:2008, SGS, UL certificate|
|26||Acceptable file format||Gerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD