Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

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Green Multi Layer Fr4 PCB High Frequency Inter Modulation Rigid PCB Board

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Good quality Multilayer PCB
Good quality Multilayer PCB
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Fr4 PCB

  • High Precision Fr4 PCB suppliers

Introduction:

High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.

 

Material:

(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

FAQ:

Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?

A:YES

Fr4 PCB Sample Introduction

Green Multi Layer Fr4 PCB High Frequency Inter Modulation Rigid PCB Board

China Green Multi Layer Fr4 PCB High Frequency Inter Modulation Rigid PCB Board Supplier

Large Image :  Green Multi Layer Fr4 PCB High Frequency Inter Modulation Rigid PCB Board

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: FR4 Layer: 6
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 245*36MM Panel: 1
Surface: Immersion Gold

Multi-Layer PCB High Frequency Inter-Modulation Rigid PCB Board

 
Key Specifications/Special Features:
-Layer: 1-20
-Material: FR4 Laminate RoHS Compliance/High TG/Halogen Free/Aluminum Base
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20µm
-Soldermasks: Green/Blue/Red/Black/Yellow/White
-Legend: White/Black/Yellow/Green
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
-Certificates: UL, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009

 
Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
 
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
 

PCB Manufacturing Capabilities

 Smallest drill size of 0.1mm (~4mil)

 1 to 36 layers

 FR4, Rogers, Taconic,Arlon,F4B

 PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.

 0.4 ounce to 4 ounce copper

 Minimum Trace / Space of 3mil.

 Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.

 Board finish colors; Green, Blue, Black, Yellow, Red, White.
 
Parameter:

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

 

 
Rigid PCB Manufacturing Capabilities
Total Pad Size Standard Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:01
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:01
 

Product parameter of prototype pcb 

1 Layers Single Sided,2 to 18 Layer
2 Board material type Rogers,Taconic,F4B,Isola and more
3 Compound material lamination 4 to 6 layers
4 Maximum dimension 610 x 1,100mm
5 Dimension tolerance ±0.13mm
6 Board thickness coverage 0.2 to 6.00mm
7 Board thickness tolerance Board thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
8 DK thickness 0.076 to 6.00mm
9 Minimum line width 0.10mm
10 Minimum line space 0.10mm
11 Outer layer copper thickness 8.75 to 175µm
12 Inner layer copper thickness 17.5 to 175µm
13 Drilling hole diameter (mechanical drill) 0.25 to 6.00mm
14 Finished hole diameter (mechanical drill) 0.20 to 6.00mm
15 Hole diameter tolerance (mechanical drill) 0.05mm
16 Hole position tolerance (mechanical drill) 0.075mm
17 Laser drill hole size 0.10mm
18 Board thickness and hole diameter ratio 10:01
19 Solder mask type Green, Yellow, Black, Purple, Blue, White and Red
20 Minimum solder mask Ø0.10mm
21 Minimum size of solder mask separation ring 0.05mm
22 Solder mask oil plug hole diameter 0.25 to 0.60mm
23 Impedance control tolerance ±10%
24 Surface finish Hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
25 Certificate ROHS, ISO9001:2008, SGS, UL certificate
26 Acceptable file format Gerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD


 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

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