Shenzhen Xinchenger Electronic Co.,Ltd

 Printed Circuit Board Manufacturer

 Multilayer&High Frequency PCB 

 Blind Buried Vias Hole

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home SamplesFr4 PCB

6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply

PCB Certifications
Good quality Multilayer PCB
Good quality Multilayer PCB
Customer Reviews
Thanks for your suggestion, Rogers+fr4 mixed-press greatly reduced our costs. Looking forward to our long-term cooperation.

—— Marco Pinheiro

Professional engineer team and production line. Besides that ,fast delivery and high quality are always the best for our sales program.

—— Martinez Alberto

I'm Online Chat Now

Fr4 PCB

  • High Precision Fr4 PCB suppliers

Introduction:

High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board

High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.

Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.

 

Material:

(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate

(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss

(3) Consistent with the thermal expansion coefficient of copper

(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

FAQ:

Q:How to get a PCB prototype quotation?

A:1.PCB Gerber file

2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)

Q:Is your tooling cost one-off payment?

A:YES

Fr4 PCB Sample Introduction

6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply

China 6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply Supplier

Large Image :  6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply

Product Details:

Place of Origin: China
Brand Name: XCE
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Model Number: XCEM

Payment & Shipping Terms:

Minimum Order Quantity: 1pcs
Price: negotiation
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Delivery Time: 5-10 days
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Detailed Product Description
Material: FR4 Layer: 6
Color: Green Min Line Space: 4mil
Min Line Width: 4mil Copper Thickness: 1OZ
Board Size: 300*199MM Panel: 1
Surface: Immersion Tin

6 Layers PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply

 
Key Specifications/Special Features:
-Layer: 1-20
-Material: FR4 Laminate RoHS Compliance/High TG/Halogen Free/Aluminum Base
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20µm
-Soldermasks: Green/Blue/Red/Black/Yellow/White
-Legend: White/Black/Yellow/Green
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
-Certificates: UL, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009

 
Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
 
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
 

PCB capability and services:
1. Single-sided, double side & multi-layer PCB. Rogers&Taconic&F4B PCB with competitive price,
good quality and excellent service.
2. Rogers,Taconic,F4B,Isola,Arlon, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Quantities range from sample to mass order<
5. 100% E-Test
SMT (Surface mounting technology), COB, DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6.OEM/ODM also welcomed
 

 
Parameter:

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

 

 
Rigid PCB Manufacturing Capabilities
Total Pad Size Standard Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:01
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:01
 
Turn Times Selected Volume Selected Solder Types
Same day through four weeks turns No minimum order quantity Leaded
Scheduled deliveries Engineering prototypes Lead-free/RoHS compliant
  Low cost first article builds No-clean process available
Parts Procurement Selected Stencils Selected Ball Grid Arrays (BGA)
Turnkey Laser cut stainless steel As small as .5mm pitch
Kitted/Consigned Nano-coating available All BGA placements are x-ray inspected
Partial Turnkey    
Assembly Types Selected Component Types Selected Other Capabilities
Surface Mount (SMT) As small as 0402 package Pitch components as small as 15 mil
Thru-hole As small as 0201 with design review Repair/Rework services
Mixed Technology (SMT/Thru-hole)   Mechanical Assembly
Single or double sided placement   Box Build/Electromechanical Assembly
    Sub-assemblies

 


 

Contact Details
Shenzhen Xinchenger Electronic Co.,Ltd

Contact Person: Karen

Send your inquiry directly to us (0 / 3000)