High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Color:||Green||Min Line Space:||4mil|
|Min Line Width:||4mil||Copper Thickness:||1OZ|
Electrical 6 Layer PCB Printed Circuit Board for Equipments Impedance Control/UL/RoHS
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
Tg value: tg135-tg180
surface treatment:Hasl lead free+gold finger
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
PCB Manufacturing Capabilities
Smallest drill size of 0.1mm (~4mil)
1 to 36 layers
FR4, Rogers, Taconic,Arlon,F4B
PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.
0.4 ounce to 4 ounce copper
Minimum Trace / Space of 3mil.
Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.
Board finish colors; Green, Blue, Black, Yellow, Red, White.
|Product name||FR4 PCB||Double side||4 layer||6 layer||8 layer||10-28layer|
|layer||Single side||Double side||4 layer||6 layer||8 layer||10-28layer|
|Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|Solder masker color||green,red,black,white,yellow|
|Tolerance||- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
|Special requirements||Buried and blind vias+controlled impedance +BGA|
|Total Pad Size||Standard||Advanced|
|Capture Pad||Drill + 0.008||Drill + 0.006|
|Landing Pad||Drill + 0.008||Drill + 0.006|
|BC Mechanical Drill (Type III)||0.008||0.006|
|Laser Drill Size||0.004-0.010||0.0025|
|Type I Capabilities single & Double Deep||Yes||Yes|
|Type II Capabilities Buried Vias with Microvias||Yes||Yes|
|Type III Capabilities||Yes||Yes|
|Copper Filled Microvia||Yes||Yes|
|Smallest Copper Filled Microvia||0.004||0.0025|
|Copper Filled Microvia Aspect Ratio||0.75:1||1:01|
|Smallest Laser Microvia Hole Size||0.004||0.0025|
|Laser Via Aspect Ratio (Depth:Diameter)||0.75:1||1:01|
|Turn Times||Selected Volume||Selected Solder Types|
|Same day through four weeks turns||No minimum order quantity||Leaded|
|Scheduled deliveries||Engineering prototypes||Lead-free/RoHS compliant|
|Low cost first article builds||No-clean process available|
|Parts Procurement||Selected Stencils||Selected Ball Grid Arrays (BGA)|
|Turnkey||Laser cut stainless steel||As small as .5mm pitch|
|Kitted/Consigned||Nano-coating available||All BGA placements are x-ray inspected|
|Assembly Types||Selected Component Types||Selected Other Capabilities|
|Surface Mount (SMT)||As small as 0402 package||Pitch components as small as 15 mil|
|Thru-hole||As small as 0201 with design review||Repair/Rework services|
|Mixed Technology (SMT/Thru-hole)||Mechanical Assembly|
|Single or double sided placement||Box Build/Electromechanical Assembly|