High frequency board usually use FR4 glass fiber lamination, but also the whole of the epoxy glass cloth repression, more uniform color the entire pcb board, bright. Density larger than the low frequency pcb board
High-frequency electronic devices is the development trend, especially in the growing wireless networks, satellite communications, and information products to high speed and high-frequency, and voice communications products to large capacity and fast transmission of wireless, video, and data normalization.
Therefore, the development of next-generation products require high frequency board, satellite systems, mobile phone base stations and other communications products received must be applied to high-frequency circuit boards, and the inevitable rapid development in the coming years, will be a large demand for high-frequency board.
(1) The dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transfer rate
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller dielectric loss the smaller signal loss
(3) Consistent with the thermal expansion coefficient of copper
(4) Low water absorption, high water absorption will affect the dielectric constant and dielectric loss at the time of moisture.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Q:How to get a PCB prototype quotation?
A:1.PCB Gerber file
2.PCB technics requirements(board thickness, copper thickness, solder mask color, surface treatment)
Q:Is your tooling cost one-off payment?
Payment & Shipping Terms:
|Color:||Green||Min Line Space:||4mil|
|Min Line Width:||4mil||Copper Thickness:||1OZ|
6-Layer HDI Multilayer PCB, Immersion Gold Surface Finishes Board
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
Tg value: tg135-tg180
surface treatment:Hasl lead free+gold finger
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )
PCB Manufacturing Capabilities
Smallest drill size of 0.1mm (~4mil)
1 to 36 layers
FR4, Rogers, Taconic,Arlon,F4B
PCB Fabrication thickness starting at 8mil for Rigid and 0.2mm for Flex.
0.4 ounce to 4 ounce copper
Minimum Trace / Space of 3mil.
Finishes include; immersion Gold, Silver, Tin, Lead free HASL and OSP.
Board finish colors; Green, Blue, Black, Yellow, Red, White.
|Product name||FR4 PCB||Double side||4 layer||6 layer||8 layer||10-28layer|
|layer||Single side||Double side||4 layer||6 layer||8 layer||10-28layer|
|Surface finishing:||HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating|
|Solder masker color||green,red,black,white,yellow|
|Tolerance||- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
|Special requirements||Buried and blind vias+controlled impedance +BGA|
|Total Pad Size||Standard||Advanced|
|Capture Pad||Drill + 0.008||Drill + 0.006|
|Landing Pad||Drill + 0.008||Drill + 0.006|
|BC Mechanical Drill (Type III)||0.008||0.006|
|Laser Drill Size||0.004-0.010||0.0025|
|Type I Capabilities single & Double Deep||Yes||Yes|
|Type II Capabilities Buried Vias with Microvias||Yes||Yes|
|Type III Capabilities||Yes||Yes|
|Copper Filled Microvia||Yes||Yes|
|Smallest Copper Filled Microvia||0.004||0.0025|
|Copper Filled Microvia Aspect Ratio||0.75:1||1:01|
|Smallest Laser Microvia Hole Size||0.004||0.0025|
|Laser Via Aspect Ratio (Depth:Diameter)||0.75:1||1:01|
|Layers||1-16 layers||Min Board Thickness(2-layer)||0.2mm|
|Max Board Size||635 × 1100mm||Min Board Thickness(4-layer)||0.6mm|
|Min Board Size||20 × 30mm||Min Inner-layer Thickness||0.1mm|
|Min Trace||0.1mm||Min Annular Ring||0.1mm|
|Min Space||0.1mm||Min Hole Location Tolerance||±0.075mm|
|Min Hole Size||0.2mm||Min Hole Size Tolerance||±0.05mm|
|Board Warp||≤ 1°||Min Outer Dimension Tolerance||±0.1mm|
|Solder Mask||Green, Yellow, Red, Black, Blue, White|
|Surface Finish||HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP|
|Board Material||FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic|
|Acceptable file||Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD|
|CAM software||Genesis, CAM350|